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PCF8577AP

Description
Interface Circuit, CMOS, PDIP40
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size1MB,22 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

PCF8577AP Overview

Interface Circuit, CMOS, PDIP40

PCF8577AP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP40,.6
Reach Compliance Codeunknown
display modeSEGMENT
JESD-30 codeR-PDIP-T40
JESD-609 codee0
Number of base plates2-BP
Number of segments32
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply2.5/9 V
Certification statusNot Qualified
Maximum slew rate0.25 mA
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

PCF8577AP Related Products

PCF8577AP PCF8577CAT PCF8577P PCF8577U/10 PCF8577U/5 PCF8577CTD
Description Interface Circuit, CMOS, PDIP40 Interface Circuit, CMOS, PDSO40 Interface Circuit, CMOS, PDIP40 Interface Circuit, CMOS Interface Circuit, CMOS Interface Circuit, CMOS, PDSO40
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Code unknown unknown unknown unknown unknown _compli
display mode SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT
Number of base plates 2-BP 2-BP 2-BP 2-BP 2-BP 2-BP
Number of segments 32 32 32 32 32 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Encapsulate equivalent code DIP40,.6 SOP40,.5,30 DIP40,.6 FFC,40PADS WAFER SOP40,.5,30
power supply 2.5/9 V 3/5 V 2.5/9 V 2.5/9 V 2.5/9 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.25 mA 0.125 mA 0.25 mA 0.25 mA 0.25 mA 0.125 mA
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Is it Rohs certified? incompatible incompatible incompatible - - incompatible
package instruction DIP, DIP40,.6 SSOP, SOP40,.5,30 DIP, DIP40,.6 , FFC,40PADS , WAFER -
JESD-30 code R-PDIP-T40 R-PDSO-G40 R-PDIP-T40 - - R-PDSO-G40
JESD-609 code e0 e0 e0 - - e0
Number of terminals 40 40 40 40 - 40
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
encapsulated code DIP SSOP DIP - - SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR
Package form IN-LINE SMALL OUTLINE, SHRINK PITCH IN-LINE - - SMALL OUTLINE, SHRINK PITCH
surface mount NO YES NO - - YES
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE - - GULL WING
Terminal pitch 2.54 mm 0.75 mm 2.54 mm - - 0.75 mm
Terminal location DUAL DUAL DUAL - - DUAL
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