PCF8577U/10 datasheet, PDF - EEWORLD Datasheet

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PCF8577U/10: DescriptionInterface Circuit, CMOS; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size1MB，22 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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PCF8577U/10 Overview

Interface Circuit, CMOS

PCF8577U/10 Parametric

Parameter Name	Attribute value
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	, FFC,40PADS
Reach Compliance Code	unknown
display mode	SEGMENT
Number of base plates	2-BP
Number of segments	32
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Encapsulate equivalent code	FFC,40PADS
power supply	2.5/9 V
Certification status	Not Qualified
Maximum slew rate	0.25 mA
technology	CMOS
Temperature level	INDUSTRIAL

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PCF8577U/10 Related Products

	PCF8577U/10	PCF8577CAT	PCF8577P	PCF8577AP	PCF8577U/5	PCF8577CTD
Description	Interface Circuit, CMOS	Interface Circuit, CMOS, PDSO40	Interface Circuit, CMOS, PDIP40	Interface Circuit, CMOS, PDIP40	Interface Circuit, CMOS	Interface Circuit, CMOS, PDSO40
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	_compli
display mode	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT
Number of base plates	2-BP	2-BP	2-BP	2-BP	2-BP	2-BP
Number of segments	32	32	32	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Encapsulate equivalent code	FFC,40PADS	SOP40,.5,30	DIP40,.6	DIP40,.6	WAFER	SOP40,.5,30
power supply	2.5/9 V	3/5 V	2.5/9 V	2.5/9 V	2.5/9 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.25 mA	0.125 mA	0.25 mA	0.25 mA	0.25 mA	0.125 mA
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
package instruction	, FFC,40PADS	SSOP, SOP40,.5,30	DIP, DIP40,.6	DIP, DIP40,.6	, WAFER	-
Number of terminals	40	40	40	40	-	40
Is it Rohs certified?	-	incompatible	incompatible	incompatible	-	incompatible
JESD-30 code	-	R-PDSO-G40	R-PDIP-T40	R-PDIP-T40	-	R-PDSO-G40
JESD-609 code	-	e0	e0	e0	-	e0
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	SSOP	DIP	DIP	-	SSOP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	SMALL OUTLINE, SHRINK PITCH	IN-LINE	IN-LINE	-	SMALL OUTLINE, SHRINK PITCH
surface mount	-	YES	NO	NO	-	YES
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE	-	GULL WING
Terminal pitch	-	0.75 mm	2.54 mm	2.54 mm	-	0.75 mm
Terminal location	-	DUAL	DUAL	DUAL	-	DUAL

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