PCF8577P datasheet, PDF - EEWORLD Datasheet

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PCF8577P: DescriptionInterface Circuit, CMOS, PDIP40; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size1MB，22 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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PCF8577P Overview

Interface Circuit, CMOS, PDIP40

PCF8577P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
display mode	SEGMENT
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
Number of base plates	2-BP
Number of segments	32
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2.5/9 V
Certification status	Not Qualified
Maximum slew rate	0.25 mA
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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PCF8577P Related Products

	PCF8577P	PCF8577CAT	PCF8577AP	PCF8577U/10	PCF8577U/5	PCF8577CTD
Description	Interface Circuit, CMOS, PDIP40	Interface Circuit, CMOS, PDSO40	Interface Circuit, CMOS, PDIP40	Interface Circuit, CMOS	Interface Circuit, CMOS	Interface Circuit, CMOS, PDSO40
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	_compli
display mode	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT	SEGMENT
Number of base plates	2-BP	2-BP	2-BP	2-BP	2-BP	2-BP
Number of segments	32	32	32	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Encapsulate equivalent code	DIP40,.6	SOP40,.5,30	DIP40,.6	FFC,40PADS	WAFER	SOP40,.5,30
power supply	2.5/9 V	3/5 V	2.5/9 V	2.5/9 V	2.5/9 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.25 mA	0.125 mA	0.25 mA	0.25 mA	0.25 mA	0.125 mA
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-	incompatible
package instruction	DIP, DIP40,.6	SSOP, SOP40,.5,30	DIP, DIP40,.6	, FFC,40PADS	, WAFER	-
JESD-30 code	R-PDIP-T40	R-PDSO-G40	R-PDIP-T40	-	-	R-PDSO-G40
JESD-609 code	e0	e0	e0	-	-	e0
Number of terminals	40	40	40	40	-	40
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	DIP	SSOP	DIP	-	-	SSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	IN-LINE	-	-	SMALL OUTLINE, SHRINK PITCH
surface mount	NO	YES	NO	-	-	YES
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	-	-	GULL WING
Terminal pitch	2.54 mm	0.75 mm	2.54 mm	-	-	0.75 mm
Terminal location	DUAL	DUAL	DUAL	-	-	DUAL

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