TMC2210J0V95 datasheet, PDF - EEWORLD Datasheet

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TMC2210J0V95: DescriptionMultiplier Accumulator/Summer, CMOS, CDIP64,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size409KB，12 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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TMC2210J0V95 Overview

Multiplier Accumulator/Summer, CMOS, CDIP64,

TMC2210J0V95 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
Reach Compliance Code	compliant
JESD-30 code	R-XDIP-T64
JESD-609 code	e0
Number of terminals	64
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP64,.9
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

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TMC2210J0V95 Related Products

	TMC2210J0V95	TMC2210N0C80	TMC2210N0C95	TMC2210G8C65	TMC2210H8C80	TMC2210G8V95
Description	Multiplier Accumulator/Summer, CMOS, CDIP64,	Multiplier Accumulator/Summer, CMOS, PDIP64	Multiplier Accumulator/Summer, CMOS, PDIP64,	Multiplier Accumulator/Summer, CMOS, CPGA68	Multiplier Accumulator/Summer, CMOS, PPGA68,	Multiplier Accumulator/Summer, CMOS, CPGA68,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild
Reach Compliance Code	compliant	unknown	compliant	unknown	compliant	compli
JESD-30 code	R-XDIP-T64	R-PDIP-T64	R-PDIP-T64	S-XPGA-P68	S-PPGA-P68	S-XPGA-P68
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	64	64	64	68	68	68
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	PGA	PGA	PGA
Encapsulate equivalent code	DIP64,.9	DIP64,.9	DIP64,.9	PGA68,11X11	PGA68,11X11	PGA68,11X11
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	GRID ARRAY	GRID ARRAY	GRID ARRAY
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

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