Multiplier Accumulator/Summer, CMOS, PDIP64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP64,.9 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP64,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches | 1 |
| TMC2210N0C80 | TMC2210N0C95 | TMC2210G8C65 | TMC2210J0V95 | TMC2210H8C80 | TMC2210G8V95 | |
|---|---|---|---|---|---|---|
| Description | Multiplier Accumulator/Summer, CMOS, PDIP64 | Multiplier Accumulator/Summer, CMOS, PDIP64, | Multiplier Accumulator/Summer, CMOS, CPGA68 | Multiplier Accumulator/Summer, CMOS, CDIP64, | Multiplier Accumulator/Summer, CMOS, PPGA68, | Multiplier Accumulator/Summer, CMOS, CPGA68, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | unknown | compliant | unknown | compliant | compliant | compli |
| JESD-30 code | R-PDIP-T64 | R-PDIP-T64 | S-XPGA-P68 | R-XDIP-T64 | S-PPGA-P68 | S-XPGA-P68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 64 | 64 | 68 | 64 | 68 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | PGA | DIP | PGA | PGA |
| Encapsulate equivalent code | DIP64,.9 | DIP64,.9 | PGA68,11X11 | DIP64,.9 | PGA68,11X11 | PGA68,11X11 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | GRID ARRAY | IN-LINE | GRID ARRAY | GRID ARRAY |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | THROUGH-HOLE | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | PERPENDICULAR | DUAL | PERPENDICULAR | PERPENDICULAR |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
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