TMC2210G8V95 datasheet, PDF - EEWORLD Datasheet

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TMC2210G8V95: DescriptionMultiplier Accumulator/Summer, CMOS, CPGA68,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size409KB，12 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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TMC2210G8V95 Overview

Multiplier Accumulator/Summer, CMOS, CPGA68,

TMC2210G8V95 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
Reach Compliance Code	compli
ECCN code	3A001.A.2.C
JESD-30 code	S-XPGA-P68
JESD-609 code	e0
Number of terminals	68
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	PGA68,11X11
Package shape	SQUARE
Package form	GRID ARRAY
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

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TMC2210G8V95 Related Products

	TMC2210G8V95	TMC2210N0C80	TMC2210N0C95	TMC2210G8C65	TMC2210J0V95	TMC2210H8C80
Description	Multiplier Accumulator/Summer, CMOS, CPGA68,	Multiplier Accumulator/Summer, CMOS, PDIP64	Multiplier Accumulator/Summer, CMOS, PDIP64,	Multiplier Accumulator/Summer, CMOS, CPGA68	Multiplier Accumulator/Summer, CMOS, CDIP64,	Multiplier Accumulator/Summer, CMOS, PPGA68,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild
Reach Compliance Code	compli	unknown	compliant	unknown	compliant	compliant
JESD-30 code	S-XPGA-P68	R-PDIP-T64	R-PDIP-T64	S-XPGA-P68	R-XDIP-T64	S-PPGA-P68
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	68	64	64	68	64	68
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	125 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	PGA	DIP	DIP	PGA	DIP	PGA
Encapsulate equivalent code	PGA68,11X11	DIP64,.9	DIP64,.9	PGA68,11X11	DIP64,.9	PGA68,11X11
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	GRID ARRAY	IN-LINE	IN-LINE	GRID ARRAY	IN-LINE	GRID ARRAY
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	THROUGH-HOLE	THROUGH-HOLE	PIN/PEG	THROUGH-HOLE	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	DUAL	DUAL	PERPENDICULAR	DUAL	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER	DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

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