LM158U/883B datasheet, PDF - EEWORLD Datasheet

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LM158U/883B: DescriptionIC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC; CategoryAnalog mixed-signal IC Amplifier circuit; File Size520KB，9 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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LM158U/883B Overview

IC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC

LM158U/883B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DFP, FL10,.3
Reach Compliance Code	not_compliant
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
frequency compensation	YES
Maximum input offset voltage	7000 µV
JESD-30 code	R-XDFP-F10
low-dissonance	NO
Number of functions	2
Number of terminals	10
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL10,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	+-1.5/+-15/3/30 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

LM158U/883B Related Products

	LM158U/883B	LM158FH/883B	LM358D1	LM158JG/883B	LM2904JG/883B	LM358AP1	LM358APP1	LM158FK/883B	LM358DP1	LM358U
Description	IC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC	IC,OP-AMP,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC	IC,OP-AMP,DUAL,BIPOLAR,SOP,8PIN,PLASTIC	IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC	IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC	IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC	IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC	IC,OP-AMP,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC	IC,OP-AMP,DUAL,BIPOLAR,SOP,8PIN,PLASTIC	IC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
frequency compensation	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-XDFP-F10	S-XQCC-N20	R-PDSO-G8	R-XDIP-T8	R-XDIP-T8	R-PDIP-T8	R-PDIP-T8	S-XQCC-N20	R-PDSO-G8	R-XDFP-F10
low-dissonance	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of functions	2	2	2	2	2	2	2	2	2	2
Number of terminals	10	20	8	8	8	8	8	20	8	10
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C	85 °C	70 °C	70 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	QCCN	SOP	DIP	DIP	DIP	DIP	QCCN	SOP	DFP
Encapsulate equivalent code	FL10,.3	LCC20,.35SQ	SOP8,.25	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	LCC20,.35SQ	SOP8,.25	FL10,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	SMALL OUTLINE	FLATPACK
power supply	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-13/3/26 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	NO	NO	NO	NO	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY	INDUSTRIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	FLAT	NO LEAD	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	GULL WING	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL
Maker	Texas Instruments	-	-	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DFP, FL10,.3	-	-	-	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	QCCN, LCC20,.35SQ	-	DFP, FL10,.3
Maximum input offset voltage	7000 µV	7000 µV	9000 µV	7000 µV	-	5000 µV	5000 µV	7000 µV	9000 µV	9000 µV

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