Basic information of LM358D1 amplifier:
LM358D1 is an OPERATIONAL AMPLIFIER.
LM358D1 amplifier core information:
The minimum operating temperature of the LM358D1 is 70 °C.
The power supply range is: +-1.5/+-15/3/30 V. The input offset voltage of LM358D1 is 9000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LM358D1:
LM358D1 has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 1.27 mm.
LM358D1 amplifier additional information:
LM358D1 adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LM358D1 is: YES. Its temperature grade is: COMMERCIAL. The LM358D1 is not Rohs certified.
The corresponding JESD-30 code is: R-PDSO-G8. The package code of LM358D1 is: SOP. The materials used in the LM358D1 package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LM358D1 package pin forms are: SMALL OUTLINE.
Its terminal forms are: GULL WING.
Basic information of LM358D1 amplifier:
LM358D1 is an OPERATIONAL AMPLIFIER.
LM358D1 amplifier core information:
The minimum operating temperature of the LM358D1 is 70 °C.
The power supply range is: +-1.5/+-15/3/30 V. The input offset voltage of LM358D1 is 9000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LM358D1:
LM358D1 has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 1.27 mm.
LM358D1 amplifier additional information:
LM358D1 adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of LM358D1 is: YES. Its temperature grade is: COMMERCIAL. The LM358D1 is not Rohs certified.
The corresponding JESD-30 code is: R-PDSO-G8. The package code of LM358D1 is: SOP. The materials used in the LM358D1 package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The LM358D1 package pin forms are: SMALL OUTLINE.
Its terminal forms are: GULL WING.
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | not_compliant |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 9000 µV |
| JESD-30 code | R-PDSO-G8 |
| low-dissonance | NO |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | +-1.5/+-15/3/30 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| LM358D1 | LM158FH/883B | LM158JG/883B | LM2904JG/883B | LM358AP1 | LM358APP1 | LM158FK/883B | LM358DP1 | LM158U/883B | LM358U | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC,OP-AMP,DUAL,BIPOLAR,SOP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,SOP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR,FP,10PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 code | R-PDSO-G8 | S-XQCC-N20 | R-XDIP-T8 | R-XDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | S-XQCC-N20 | R-PDSO-G8 | R-XDFP-F10 | R-XDFP-F10 |
| low-dissonance | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 8 | 20 | 8 | 8 | 8 | 8 | 20 | 8 | 10 | 10 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 85 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | SOP | QCCN | DIP | DIP | DIP | DIP | QCCN | SOP | DFP | DFP |
| Encapsulate equivalent code | SOP8,.25 | LCC20,.35SQ | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | LCC20,.35SQ | SOP8,.25 | FL10,.3 | FL10,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE | FLATPACK | FLATPACK |
| power supply | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-13/3/26 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | NO | NO | NO | NO | YES | YES | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| Maximum input offset voltage | 9000 µV | 7000 µV | 7000 µV | - | 5000 µV | 5000 µV | 7000 µV | 9000 µV | 7000 µV | 9000 µV |
| Maker | - | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | - | - | - | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | QCCN, LCC20,.35SQ | - | DFP, FL10,.3 | DFP, FL10,.3 |