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74LVC2G07GM

Description
Buffers with open-drain outputs
Categorylogic    logic   
File Size72KB,13 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

74LVC2G07GM Overview

Buffers with open-drain outputs

74LVC2G07GM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionSON, SOLCC6,.04,20
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-N6
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeSON
Encapsulate equivalent codeSOLCC6,.04,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
power supply3.3 V
Prop。Delay @ Nom-Su4.7 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74LVC2G07
Buffers with open-drain outputs
Product specification
Supersedes data of 2004 Mar 19
2004 Sep 08

74LVC2G07GM Related Products

74LVC2G07GM 74LVC2G07 74LVC2G07GV 74LVC2G07GW
Description Buffers with open-drain outputs Buffers with open-drain outputs Buffers with open-drain outputs Buffers with open-drain outputs
Is it Rohs certified? incompatible - conform to conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction SON, SOLCC6,.04,20 - TSOP, TSOP6,.11,37 TSSOP, TSSOP6,.08
Reach Compliance Code unknow - unknow unknow
JESD-30 code R-PDSO-N6 - R-PDSO-G6 R-PDSO-G6
JESD-609 code e0 - e3 e3
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type BUFFER - BUFFER BUFFER
MaximumI(ol) 0.024 A - 0.024 A 0.024 A
Number of terminals 6 - 6 6
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Output characteristics OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SON - TSOP TSSOP
Encapsulate equivalent code SOLCC6,.04,20 - TSOP6,.11,37 TSSOP6,.08
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
power supply 3.3 V - 3.3 V 3.3 V
Prop。Delay @ Nom-Su 4.7 ns - 4.7 ns 4.7 ns
Certification status Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO - NO NO
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) - Matte Tin (Sn) Matte Tin (Sn)
Terminal form NO LEAD - GULL WING GULL WING
Terminal pitch 0.5 mm - 0.95 mm 0.635 mm
Terminal location DUAL - DUAL DUAL

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