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74LVC2G07GW

Description
Buffers with open-drain outputs
Categorylogic    logic   
File Size72KB,13 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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74LVC2G07GW Overview

Buffers with open-drain outputs

74LVC2G07GW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP6,.08
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G6
JESD-609 codee3
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply3.3 V
Prop。Delay @ Nom-Su4.7 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74LVC2G07
Buffers with open-drain outputs
Product specification
Supersedes data of 2004 Mar 19
2004 Sep 08

74LVC2G07GW Related Products

74LVC2G07GW 74LVC2G07 74LVC2G07GM 74LVC2G07GV
Description Buffers with open-drain outputs Buffers with open-drain outputs Buffers with open-drain outputs Buffers with open-drain outputs
Is it Rohs certified? conform to - incompatible conform to
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP6,.08 - SON, SOLCC6,.04,20 TSOP, TSOP6,.11,37
Reach Compliance Code unknow - unknow unknow
JESD-30 code R-PDSO-G6 - R-PDSO-N6 R-PDSO-G6
JESD-609 code e3 - e0 e3
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type BUFFER - BUFFER BUFFER
MaximumI(ol) 0.024 A - 0.024 A 0.024 A
Number of terminals 6 - 6 6
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Output characteristics OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - SON TSOP
Encapsulate equivalent code TSSOP6,.08 - SOLCC6,.04,20 TSOP6,.11,37
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
power supply 3.3 V - 3.3 V 3.3 V
Prop。Delay @ Nom-Su 4.7 ns - 4.7 ns 4.7 ns
Certification status Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO - NO NO
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal form GULL WING - NO LEAD GULL WING
Terminal pitch 0.635 mm - 0.5 mm 0.95 mm
Terminal location DUAL - DUAL DUAL

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