Standard SRAM, 128KX36, 3.5ns, CMOS, PQFP100, TQFP-100
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| package instruction | TQFP-100 |
| Reach Compliance Code | compliant |
| Maximum access time | 3.5 ns |
| Maximum clock frequency (fCLK) | 166 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 19.99 mm |
| memory density | 4718592 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 36 |
| Number of functions | 1 |
| Number of terminals | 100 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX36 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum standby current | 0.005 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.23 mA |
| Maximum supply voltage (Vsup) | 3.63 V |
| Minimum supply voltage (Vsup) | 2.97 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.66 mm |
| Terminal location | QUAD |
| width | 13.99 mm |
| IS61SP12836-3.5TQ | IS61SP12836-3.5B | IS61SP12836-3.8B | IS61SP12836-3.8TQ | IS61SP12836-3.8TQI | |
|---|---|---|---|---|---|
| Description | Standard SRAM, 128KX36, 3.5ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 128KX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119 | Standard SRAM, 128KX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119 | Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| package instruction | TQFP-100 | PLASTIC, BGA-119 | PLASTIC, BGA-119 | TQFP-100 | TQFP-100 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Maximum access time | 3.5 ns | 3.5 ns | 3.8 ns | 3.8 ns | 3.8 ns |
| Maximum clock frequency (fCLK) | 166 MHz | 166 MHz | 150 MHz | 150 MHz | 150 MHz |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PQFP-G100 | R-PBGA-B119 | R-PBGA-B119 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 19.99 mm | 22 mm | 22 mm | 19.99 mm | 19.99 mm |
| memory density | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 36 | 36 | 36 | 36 | 36 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 100 | 119 | 119 | 100 | 100 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| organize | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | BGA | BGA | LQFP | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 | BGA119,7X17,50 | BGA119,7X17,50 | QFP100,.63X.87 | QFP100,.63X.87 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 2.4 mm | 2.4 mm | 1.6 mm | 1.6 mm |
| Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
| Minimum standby current | 3 V | 3 V | 3 V | 3 V | 3 V |
| Maximum slew rate | 0.23 mA | 0.23 mA | 0.22 mA | 0.22 mA | 0.23 mA |
| Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| Minimum supply voltage (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | BALL | BALL | GULL WING | GULL WING |
| Terminal pitch | 0.66 mm | 1.27 mm | 1.27 mm | 0.66 mm | 0.66 mm |
| Terminal location | QUAD | BOTTOM | BOTTOM | QUAD | QUAD |
| width | 13.99 mm | 14 mm | 14 mm | 13.99 mm | 13.99 mm |
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