IS61SP12836-3.8TQI datasheet, PDF

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IS61SP12836-3.8TQI: DescriptionStandard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100; Categorystorage storage; File Size1MB，16 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61SP12836-3.8TQI Overview

Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100

IS61SP12836-3.8TQI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TQFP-100
Reach Compliance Code	compliant
Maximum access time	3.8 ns
Maximum clock frequency (fCLK)	150 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	19.99 mm
memory density	4718592 bit
Memory IC Type	STANDARD SRAM
memory width	36
Number of functions	1
Number of terminals	100
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.005 A
Minimum standby current	3 V
Maximum slew rate	0.23 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.66 mm
Terminal location	QUAD
width	13.99 mm

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IS61SP12836-3.8TQI Related Products

	IS61SP12836-3.8TQI	IS61SP12836-3.5B	IS61SP12836-3.5TQ	IS61SP12836-3.8B	IS61SP12836-3.8TQ
Description	Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119	Standard SRAM, 128KX36, 3.5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119	Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	TQFP-100	PLASTIC, BGA-119	TQFP-100	PLASTIC, BGA-119	TQFP-100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Maximum access time	3.8 ns	3.5 ns	3.5 ns	3.8 ns	3.8 ns
Maximum clock frequency (fCLK)	150 MHz	166 MHz	166 MHz	150 MHz	150 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100	R-PBGA-B119	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0
length	19.99 mm	22 mm	19.99 mm	22 mm	19.99 mm
memory density	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	36	36	36	36	36
Number of functions	1	1	1	1	1
Number of terminals	100	119	100	119	100
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX36	128KX36	128KX36	128KX36	128KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	BGA	LQFP	BGA	LQFP
Encapsulate equivalent code	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87	BGA119,7X17,50	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE	GRID ARRAY	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	2.4 mm	1.6 mm	2.4 mm	1.6 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Minimum standby current	3 V	3 V	3 V	3 V	3 V
Maximum slew rate	0.23 mA	0.23 mA	0.23 mA	0.22 mA	0.22 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	BALL	GULL WING	BALL	GULL WING
Terminal pitch	0.66 mm	1.27 mm	0.66 mm	1.27 mm	0.66 mm
Terminal location	QUAD	BOTTOM	QUAD	BOTTOM	QUAD
width	13.99 mm	14 mm	13.99 mm	14 mm	13.99 mm

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