IS61SP12836-3.8B datasheet, PDF

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IS61SP12836-3.8B: DescriptionStandard SRAM, 128KX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119; Categorystorage storage; File Size1MB，16 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS61SP12836-3.8B Overview

Standard SRAM, 128KX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119

IS61SP12836-3.8B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
package instruction	PLASTIC, BGA-119
Reach Compliance Code	compliant
Maximum access time	3.8 ns
Maximum clock frequency (fCLK)	150 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	4718592 bit
Memory IC Type	STANDARD SRAM
memory width	36
Number of functions	1
Number of terminals	119
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum standby current	0.005 A
Minimum standby current	3 V
Maximum slew rate	0.22 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	14 mm

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IS61SP12836-3.8B Related Products

	IS61SP12836-3.8B	IS61SP12836-3.5B	IS61SP12836-3.5TQ	IS61SP12836-3.8TQ	IS61SP12836-3.8TQI
Description	Standard SRAM, 128KX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119	Standard SRAM, 128KX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119	Standard SRAM, 128KX36, 3.5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX36, 3.8ns, CMOS, PQFP100, TQFP-100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	PLASTIC, BGA-119	PLASTIC, BGA-119	TQFP-100	TQFP-100	TQFP-100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Maximum access time	3.8 ns	3.5 ns	3.5 ns	3.8 ns	3.8 ns
Maximum clock frequency (fCLK)	150 MHz	166 MHz	166 MHz	150 MHz	150 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B119	R-PBGA-B119	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0
length	22 mm	22 mm	19.99 mm	19.99 mm	19.99 mm
memory density	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	36	36	36	36	36
Number of functions	1	1	1	1	1
Number of terminals	119	119	100	100	100
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	85 °C
organize	128KX36	128KX36	128KX36	128KX36	128KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	LQFP	LQFP	LQFP
Encapsulate equivalent code	BGA119,7X17,50	BGA119,7X17,50	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.4 mm	2.4 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Minimum standby current	3 V	3 V	3 V	3 V	3 V
Maximum slew rate	0.22 mA	0.23 mA	0.23 mA	0.22 mA	0.23 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	0.66 mm	0.66 mm	0.66 mm
Terminal location	BOTTOM	BOTTOM	QUAD	QUAD	QUAD
width	14 mm	14 mm	13.99 mm	13.99 mm	13.99 mm

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