IC SPECIALTY ANALOG CIRCUIT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Analog IC:Other
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | ANALOG CIRCUIT |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply current (Isup) | 1 mA |
| Maximum supply voltage (Vsup) | 36 V |
| Minimum supply voltage (Vsup) | 4 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| LM614MJ | LM614IJ | LM614IN | |
|---|---|---|---|
| Description | IC SPECIALTY ANALOG CIRCUIT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, PDIP16, PLASTIC, DIP-16, Analog IC:Other |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| length | 19.43 mm | 19.43 mm | 21.755 mm |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply current (Isup) | 1 mA | 0.94 mA | 0.94 mA |
| Maximum supply voltage (Vsup) | 36 V | 36 V | 36 V |
| Minimum supply voltage (Vsup) | 4 V | 4 V | 4 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | - | 1 | 1 |
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