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74LVC3G04

Description
Triple inverter
File Size60KB,13 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
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74LVC3G04 Overview

Triple inverter

74LVC3G04
Triple inverter
Rev. 01 — 4 May 2004
Product data sheet
1. General description
The 74LVC3G04 is a high-performance, low-power, low-voltage, Si-gate CMOS device
and superior to most advanced CMOS compatible TTL families.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
off
. The I
off
circuitry
disables the output, preventing the damaging backflow current through the device when it
is powered down.
The 74LVC3G04 provides three inverting buffers.
2. Features
s
s
s
s
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant outputs for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
x
JESD8-7 (1.65 V to 1.95 V)
x
JESD8-5 (2.3 V to 2.7 V)
x
JESD8-B/JESD36 (2.7 V to 3.6 V).
ESD protection:
x
HBM EIA/JESD22-A114-B exceeds 2000 V
x
MM EIA/JESD22-A115-A exceeds 200 V.
±24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
SOT505-2 and SOT765-1 package
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C.
s
s
s
s
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74LVC3G04 Related Products

74LVC3G04 74LVC3G04DC 74LVC3G04DP
Description Triple inverter LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 Triple inverter
Is it Rohs certified? - conform to conform to
Maker - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction - TSSOP, TSSOP8,.12,20 TSSOP, TSSOP8,.16
Reach Compliance Code - unknown unknown
JESD-30 code - R-PDSO-G8 R-PDSO-G8
Load capacitance (CL) - 50 pF 50 pF
Logic integrated circuit type - INVERTER INVERTER
MaximumI(ol) - 0.024 A 0.024 A
Number of terminals - 8 8
Maximum operating temperature - 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - TSSOP TSSOP
Encapsulate equivalent code - TSSOP8,.12,20 TSSOP8,.16
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL
power supply - 3.3 V 3.3 V
Prop。Delay @ Nom-Sup - 5.5 ns 5.5 ns
Certification status - Not Qualified Not Qualified
Schmitt trigger - NO NO
Nominal supply voltage (Vsup) - 3.3 V 3.3 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE
Terminal form - GULL WING GULL WING
Terminal pitch - 0.5 mm 0.635 mm
Terminal location - DUAL DUAL
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