DUAL COOL
™
PACKAGE POWERTRENCH
®
MOSFETs
Dual Cool
™
packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is
the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual
path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with
Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink
is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and
increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a
clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS
compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.
Features
•
Top-side cooling, lower thermal resistance from
junction to top
•
Same land pattern as 5 mm x 6 mm and
3.3 mm x 3.3 mm PQFN – JEDEC standard
•
Allows higher current and power dissipation
•
Highest power density for DC-DC applications
•
Use with or without a heat sink, reduces the
number of qualified components in the BOM
•
Multiple suppliers without cross licensing
requirements
•
High degree of production commonality with
standard PQFN packaging
•
25 V - 150 V portfolio
Top
Bottom
3.3 mm x 3.3 mm
&
5 mm x 6 mm
Maximum Power Dissipation
Dual Cool Package
3.3mm x 3.3mm
Capable of >60% Better Thermal Performance
Air Flow =
200LFM
No Air Flow
Applications
•
Point-of-load (POL) synchronous-buck conversion
•
Servers
•
Telecommunications, routing and switching
•
Heat path from top only
Standard PQFN
3.3mm x 3.3mm
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Power Loss (W) T
J
Max. = 90°C, T
a
=50°C
5mm x 6mm Package
Interconnect
PQFN Wire
PQFN Clip
Dual Cool Package
Environment: Minimum Pad, Heat Sink, 200LFM Forced Air
Q
JA
(°C/W)
27.1
23.8
17.2
(%) Improvement from Wire Package
-
13.9
57.5
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For data sheets, application notes, samples and more, please visit:
www.fairchildsemi.com
1-Phase CCM with Heat Sink and Forced Air 200LFM
120.00
Junction Temperature (°C)
100.00
80.00
60.00
40.00
20.00
0.00
1
5
10
15 20
Load (A)
25
30
35
Dual Cool Package
3.3mm x 3.3mm
PQFN
3.3mm x 3.3mm
Top
Bottom
Dual Cool Package
Competitor Package
Board
Solderable Component
Area
Dual Cool Package
3.3mm x 3.3mm
DirectFET
% Difference
Solderable Area
The new
standard
33% less
Total
Component Area (Max)
11.56mm
2
19.16mm
2
4.5mm
2
3mm
2
Competitor
5mm x 6mm Package
Product Number
FDMS8570SDC
FDMS7650DC
FDMS3006SDC
FDMS3008SDC
FDMS3016DC
FDMS8320LDC
FDMS86500DC
FDMS86300DC
FDMS86101DC
FDMS86200DC
SyncFET
™
Technology
Y
N
Y
Y
N
N
N
N
N
N
BV
DSS
25
30
30
30
30
40
60
80
100
150
V
GS
20
20
20
20
20
20
20
20
20
20
R
DS(ON)
Max (m)
10V
2.8
0.99
1.9
2.6
6
1.1
2.3
3.1
7.5
17
8V
-
-
-
-
-
-
3.3
4
-
-
6V
-
-
-
-
-
-
-
-
12
25
4.5V
3.3
1.55
2.7
3.3
9
1.5
-
-
-
-
Qg
(nC)
22
42
26
21
7.6
57
76
72
31
30
Qgd
(nC)
4.4
9.7
5.3
4.3
2.5
16
15
14
7
5.6
3.3mm x 3.3mm Package
Product Number
FDMC7660DC
FDMC86520DC
SyncFET
Technology
N
N
BV
DSS
30
60
V
GS
20
20
R
DS(ON)
Max (m)
10V
-
6.3
8V
-
8.7
6V
-
-
4.5V
-
-
Qg
(nC)
-
29
Qgd
(nC)
-
5.5
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or their respective owners. For a listing of Fairchild Semiconductor trademarks and related
information, please see: www.fairchildsemi.com/legal
Lit. No. 100027-004 © 2013 Fairchild Semiconductor. All Rights Reserved.
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