MT28C256532W18SFT-F706P85TTWT datasheet, PDF

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MT28C256532W18SFT-F706P85TTWT: DescriptionMemory Circuit, 8MX16, CMOS, PBGA88, FBGA-88; Categorystorage storage; File Size218KB，15 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT28C256532W18SFT-F706P85TTWT Overview

Memory Circuit, 8MX16, CMOS, PBGA88, FBGA-88

MT28C256532W18SFT-F706P85TTWT Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	88
Reach Compliance Code	unknown
Other features	CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 code	R-PBGA-B88
JESD-609 code	e1
length	12 mm
memory density	134217728 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	88
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	9 mm

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PRELIMINARY

‡

256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH

32Mb/64Mb ASYNC/PAGE CellularRAM COMBO

FLASH AND CellularRAM

™

COMBO MEMORY

Features

Stacked die Combo package

• Includes two 128Mb Flash devices

• Choice of either one 32Mb or one 64Mb

CellularRAM device

Basic configuration

Flash

• Flexible multibank architecture

• 8 Meg x 16 Async/Page/Burst interface

• Support for true concurrent operations with no

latency

CellularRAM

• Low-power, high-density design

• 2 Meg x 16 or 4 Meg x 16 configurations

• Async/Page

F_V

, V

Q, F_V

, C_V

voltages

• 1.70V (MIN)/1.95V (MAX) F_V

, C_V

• 1.70V (MIN)/2.24V (MAX) V

• 1.80V (TYP) F_V

(in-system PROGRAM/ERASE)

• 12V ±5% (HV)

tolerant (factory

programming compatibility)

Fast programming Algorithm (FPA)

Enhanced suspend options

• ERASE-SUSPEND-to-READ within same bank

• PROGRAM-SUSPEND-to-READ within same

bank

• ERASE-SUSPEND-to-PROGRAM within same

bank

Each Flash contains two 64-bit chip protection

registers for security purposes

100,000 ERASE cycles per block

Cross-compatible command set support

• Extended command set

• Common Flash interface (CFI) compliant

MT28C256532W18S

MT28C256564W18S

Low Voltage, Wireless Temperature

Figure 1: 88-Ball FBGA

A18

A19

C_V

F_V

A21

A11

C_LB#

A23

C_V

F_CLK

A22

A12

A17

RFU

F_V

C_WE#

C_CE#

A13

RFU

F_WP#

F_ADV#

A20

A10

A15

C_UB#

F_RST#

F_WE#

A14

A16

DQ8

DQ2

DQ10

DQ5

DQ13

F_WAIT#

C_OE#

DQ0

DQ1

DQ3

DQ12

DQ14

DQ7

F_OE#

DQ9

DQ11

DQ4

DQ6

DQ15

F_CE#

C_V

F_V

C_ZZ#

C_V

F_VCC

C_V

F_V

C_V

Top View

(Ball Down)

NOTE:

Balls C6, E5, and G7 are only used for Flash burst operation.

Options

Flash Timing

• 60ns

• 70ns

Flash Burst Frequency

• 66 MHz

• 54 MHz

Flash Boot Block Configuration

• Top/Top

• Top/Bottom

• Bottom/Top

• Bottom/Bottom

CellularRAM Timing

• 70ns

• 85ns

I/O Voltage Range

• V

Q 1.70V–2.24V

Operating Temperature Range

• Wireless Temperature (-25°C to +85°C)

Package

• 88-ball FBGA (Standard) 8 x 10 grid with eight

support balls

• 88-ball FBGA (Lead-free) 8 x 10 grid with eight

support balls

NOTE:

1. Contact factory for availability.

2. Contact factory for details.

09005aef80bcd58d

MT28C256564W18S.fm - Rev. D Pub 2/04 EN

‡

PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY

MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.

PRELIMINARY

256Mb MULTIBANK ASYNC/PAGE OR BURST FLASH

32Mb/64Mb ASYNC/PAGE CellularRAM COMBO

Table of Contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Device General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

CellularRAM General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Boot Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

MultiChip Packaging Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Unique IDs, State Machines, and Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

WRITE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Flash Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

WAIT Ball Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Data Sheet Designation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

09005aef80bcd58d

MT28C256564W18S.fm - Rev. D Pub 2/04 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

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