EGF1A THRU EGF1D
ULTRAFAST SURFACE MOUNT RECTIFIER
FEATURES
50V-200V 1.0A
•
•
•
•
•
•
•
•
•
•
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Ideal for surface mount automotive applications
High temperature metallurgically bonded construction
Superfast recovery times for high efficiency
Glass passivated cavity-free junction
Built-in strain relief
Easy pick and place
High temperature soldering guaranteed: 450°C/5 seconds
at terminals
Complete device submersible temperature of
265°C for 10 seconds in solder bath
MECHANICAL DATA
•
•
•
•
Case:
JEDEC DO-214BA molded plastic over glass body
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Weight:
0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
EGF1A
EGF1B
EGF1C
EGF1D
UNITS
Device Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
L
=125°C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied V
R
=4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead
P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
EA
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
EB
100
70
100
1.0
EC
150
105
150
ED
200
140
200
Volts
Volts
Volts
Amps
I
FSM
V
F
I
R
t
rr
C
J
RΘJA
RΘJL
T
J
,T
STG
30.0
1.0
5.0
50.0
50.0
15.0
85.0
30.0
-65 to +175
Amps
Volts
µA
ns
pF
°C/W
°C
T
A
=25°C
T
A
=125°C
E-mail: sales@taychipst.com
1 of 2
Web Site: www.taychipst.com
EGF1A THRU EGF1D
ULTRAFAST SURFACE MOUNT RECTIFIER
50V-200V 1.0A
RATINGS AND CHARACTERISTICS CURVES EGF1A THRU EGF1D
AVERAGE FORWARD RECTIFIED CURRENT,
AMPERES
FIG. 1 - MAXIMUM FORWARD CURRENT
DERATING CURVE
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
1.0
30
PEAK FORWARD SURGE CURRENT,
AMPERES
25
20
15
10
5.0
0
1
10
T
J
=T
J
max.
8.3ms SINGLE HALF SINE WAVE
(JEDEC Method)
0.5
RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED on
0.2 x 0.2” (5.0 x 5.0mm)
COPPER PAD AREAS
0
0
25
50
75
100
125
150
175
LEAD TEMPERATURE, °C
100
NUMBER OF CYCLES AT 60 H
Z
FIG. 3 -TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
50
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
1,000
PULSE WIDTH=300µs
1% DUTY CYCLE
10
INSTANTANEOUS REVERSE LEAKAGE CURRENT,
MICROAMPERES
INSTANTANEOUS FORWARD CURRENT,
AMPERES
100
T
J
=150°C
T
J
=25°C
10
T
J
=100°C
1
T
J
=150°C
1
0.1
0.1
T
J
=25°C
0
0
0.01
0.2
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
70
JUNCTION CAPACITANCE, pF
60
50
40
30
20
10
0
0.1
1
10
T
J
=25°C
f=1.0 MHz
Vsig=50mVp-p
TRANSIENT THERMAL IMPEDANCE,
°C/W
100
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
100
10
1
0.1
0.01
0.1
REVERSE VOLTAGE, VOLTS
1
10
t, PULSE DURATION, sec.
100
E-mail: sales@taychipst.com
2 of 2
Web Site: www.taychipst.com
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
