Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64
| Parameter Name | Attribute value |
| Maker | Mitsubishi |
| Parts packaging code | DIP |
| package instruction | WSDIP, |
| Contacts | 64 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 8 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T64 |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 8 |
| Number of I/O lines | 46 |
| Number of serial I/Os | 1 |
| Number of terminals | 64 |
| Number of timers | 3 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -20 °C |
| PWM channel | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WSDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW, SHRINK PITCH |
| Certification status | Not Qualified |
| RAM (number of words) | 384 |
| rom(word) | 8000 |
| ROM programmability | MROM |
| Maximum seat height | 5.35 mm |
| speed | 8 MHz |
| Maximum slew rate | 13 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 2.7 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| M38802M2-XXXSS | M38802M1-XXXSS | M38802E2-XXXFS | M38802E2-XXXSS | M38802M2-XXXFS | |
|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 | Microcontroller, 8-Bit, UVPROM, 8MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, CQCC64, 0.80 MM PITCH, CERAMIC, LCC-64 |
| Parts packaging code | DIP | DIP | LCC | DIP | LCC |
| package instruction | WSDIP, | WSDIP, | WQCCN, | WSDIP, | WQCCN, |
| Contacts | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Has ADC | NO | NO | NO | NO | NO |
| bit size | 8 | 8 | 8 | 8 | 8 |
| boundary scan | NO | NO | NO | NO | NO |
| maximum clock frequency | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC channel | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO |
| JESD-30 code | R-CDIP-T64 | R-CDIP-T64 | S-CQCC-N64 | R-CDIP-T64 | S-CQCC-N64 |
| low power mode | YES | YES | YES | YES | YES |
| Number of external interrupt devices | 8 | 8 | 8 | 8 | 8 |
| Number of I/O lines | 46 | 46 | 46 | 46 | 46 |
| Number of serial I/Os | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 |
| Number of timers | 3 | 3 | 3 | 3 | 3 |
| On-chip data RAM width | 8 | 8 | 8 | 8 | 8 |
| On-chip program ROM width | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| PWM channel | NO | NO | NO | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WSDIP | WSDIP | WQCCN | WSDIP | WQCCN |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE, WINDOW, SHRINK PITCH | IN-LINE, WINDOW, SHRINK PITCH | CHIP CARRIER, WINDOW | IN-LINE, WINDOW, SHRINK PITCH | CHIP CARRIER, WINDOW |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (number of words) | 384 | 384 | 384 | 384 | 384 |
| rom(word) | 8000 | 4000 | 8000 | 8000 | 8000 |
| ROM programmability | MROM | MROM | UVPROM | UVPROM | MROM |
| Maximum seat height | 5.35 mm | 5.35 mm | 3.13 mm | 5.35 mm | 3.13 mm |
| speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| Maximum slew rate | 13 mA | 13 mA | 13 mA | 13 mA | 13 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.778 mm | 1.778 mm | 0.8 mm | 1.778 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | QUAD |
| width | 19.05 mm | 19.05 mm | 15.6 mm | 19.05 mm | 15.6 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Maker | Mitsubishi | - | Mitsubishi | Mitsubishi | Mitsubishi |
Embedded System
MCU
Test/Measurement
Embedded System
Embedded System
Discrete Device
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