RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA179
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | PGA |
| package instruction | PGA, PGA179,18X18 |
| Contacts | 179 |
| Reach Compliance Code | not_compliant |
| bit size | 64 |
| JESD-30 code | S-XPGA-P179 |
| JESD-609 code | e0 |
| Number of terminals | 179 |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA179,18X18 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| speed | 67 MHz |
| Maximum slew rate | 3200 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | 30 |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| 79R4400PC-67G | 79R4400MC-50G447 | 79R4400PC-75G | 79R4400PC-50G | 79R4400SC-50G447 | 79R4400SC-75G447 | 79R4400SC-67G447 | |
|---|---|---|---|---|---|---|---|
| Description | RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA179 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA447 | RISC Microprocessor, 64-Bit, 75MHz, CMOS, CPGA179 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA179 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA447 | RISC Microprocessor, 64-Bit, 75MHz, CMOS, CPGA447 | RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA447 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| package instruction | PGA, PGA179,18X18 | PGA, SPGA447,39X39 | PGA, PGA179,18X18 | PGA, PGA179,18X18 | PGA, SPGA447,39X39 | PGA, SPGA447,39X39 | PGA, SPGA447,39X39 |
| Contacts | 179 | 447 | 179 | 179 | 447 | 447 | 447 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| bit size | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| JESD-30 code | S-XPGA-P179 | S-XPGA-P447 | S-XPGA-P179 | S-XPGA-P179 | S-XPGA-P447 | S-XPGA-P447 | S-XPGA-P447 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 179 | 447 | 179 | 179 | 447 | 447 | 447 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| Encapsulate equivalent code | PGA179,18X18 | SPGA447,39X39 | PGA179,18X18 | PGA179,18X18 | SPGA447,39X39 | SPGA447,39X39 | SPGA447,39X39 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| speed | 67 MHz | 50 MHz | 75 MHz | 50 MHz | 50 MHz | 75 MHz | 67 MHz |
| Maximum slew rate | 3200 mA | 2800 mA | 3600 mA | 2800 mA | 2800 mA | 3600 mA | 3200 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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