MK53DX256CMD10 datasheet, PDF - EEWORLD Datasheet

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MK53DX256CMD10: DescriptionRISC MICROCONTROLLER; Categorysemiconductor The embedded processor and controller; File Size2MB，85 Pages; ManufacturerFREESCALE (NXP)

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MK53DX256CMD10 Overview

RISC MICROCONTROLLER

MK53DX256CMD10 Parametric

Parameter Name	Attribute value
state	ACTIVE
Microprocessor type	Reduced Instruction Set Microcontroller

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: K53P144M100SF2V2

Rev. 1, 6/2012

Supports the following:

MK53DN512CLQ10,

MK53DN512CMD10,

MK53DX256CLQ10,

MK53DX256CMD10

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 85°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 63

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Segment LCD controller supporting up to 40

frontplanes and 8 backplanes, or 44 frontplanes and

4 backplanes, depending on the package size

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Two operational amplifiers

– Two transimpedance amplifiers

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

K53 Sub-Family

K53P144M100SF2V2

This document contains information on a new product. Specifications and

information herein are subject to change without notice.

Preliminary

General Business Information

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................11

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 AC electrical characteristics..............................................12

5.2 Nonswitching electrical specifications...............................12

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements......13

LVD and POR operating requirements...............14

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......15

Power consumption operating behaviors............16

EMC radiated emissions operating behaviors....19

Designing with radiated emissions in mind.........20

Capacitance attributes........................................20

6.8.6

6.6.7

6.6.6

5.4.2

Thermal attributes...............................................22

6 Peripheral operating requirements and behaviors....................23

6.1 Core modules....................................................................23

6.1.1

6.1.2

Debug trace timing specifications.......................23

JTAG electricals..................................................24

6.2 System modules................................................................27

6.3 Clock modules...................................................................27

6.3.1

6.3.2

6.3.3

MCG specifications.............................................27

Oscillator electrical specifications.......................29

32 kHz Oscillator Electrical Characteristics........32

6.4 Memories and memory interfaces.....................................32

6.4.1

6.4.2

6.4.3

Flash electrical specifications.............................32

EzPort Switching Specifications.........................37

Flexbus Switching Specifications........................38

6.5 Security and integrity modules..........................................41

6.6 Analog...............................................................................41

6.6.1

6.6.2

6.6.3

6.6.4

6.6.5

ADC electrical specifications..............................41

CMP and 6-bit DAC electrical specifications......49

12-bit DAC electrical characteristics...................52

Op-amp electrical specifications.........................55

Transimpedance amplifier electrical

specifications — full range..................................56

Transimpedance amplifier electrical

specifications — limited range............................57

Voltage reference electrical specifications..........58

6.7 Timers................................................................................59

6.8 Communication interfaces.................................................59

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

Ethernet switching specifications........................59

USB electrical specifications...............................61

USB DCD electrical specifications......................61

USB VREG electrical specifications...................62

DSPI switching specifications (limited voltage

range).................................................................62

DSPI switching specifications (full voltage

range).................................................................64

6.8.7

6.8.8

6.8.9

6.8.10

I2C switching specifications................................66

UART switching specifications............................66

SDHC specifications...........................................66

I2S/SAI Switching Specifications........................67

5.3 Switching specifications.....................................................20

5.3.1

5.3.2

Device clock specifications.................................20

General switching specifications.........................21

5.4 Thermal specifications.......................................................22

5.4.1

Thermal operating requirements.........................22

K53 Sub-Family Data Sheet, Rev. 1, 6/2012.

Freescale Semiconductor, Inc.

Preliminary

General Business Information

MK53DX256CMD10 Related Products

	MK53DX256CMD10	K53P144M100SF2V2	MK53DN512CLQ10
Description	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER
state	ACTIVE	ACTIVE	ACTIVE
Microprocessor type	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller	Reduced Instruction Set Microcontroller

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