FERRITE CHIP INDUCTORS
L201610 SERIES
(d) Tolerance code : M = ±20%, Y = ±30%
(e) Internal Controller Number
L2016101R0M-
(a)
(b)
(c)
(d)
(e)
(a) Series code
(b) Dimension code
(c) Inductance code : 1R0 = 1.0uH
2. CONFIGURATION & DIMENSIONS :
A
D
B
C
Unit:m/m
A
2.0 ±0.3
B
1.6 ±0.2
C
1.0 Max.
D
0.50 ±0.3
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 40°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -40°C to +105°C
d) Operating temp. : -40°C to +105°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS :
L201610 SERIES
Part Number
L2016101R0M-
L2016101R5M-
L2016102R2M-
L2016103R3M-
L2016104R7M-
Inductance
(µH)
1.0 ±20%
1.5 ±20%
2.2 ±20%
3.3 ±20%
4.7 ±20%
Test Frequency
(MHz)
1
1
1
1
1
Rated Current
(mA) Max
1300
1300
1200
1000
900
DC Resistance
( )
0.12 ±30%
0.12 ±30%
0.14 ±30%
0.18 ±30%
0.23 ±30%
SRF
(MHz) Min
110
75
70
50
40
6-1. INDUCTANCE VS. FREQUENCY CURVE :
6-2 INDUCTANCE-CURRENT CURVE :
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
7. RELIABILITY & TEST CONDITION :
L201610 SERIES
TEST CONDITION
Long storage conditions, please see the aplication notice
HP4291, HP E4991+HP4287 +HP16192
HP4338
DC Power Supply, over rated current ,there will be some risk
ITEM
Operating Temperature
Storage Temperature
Inductance
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
-40~+105°C
PERFORMANCE
-40~+105°C (Including self-temperature rise)
Refer to standard electrical characteristics list
40°C max. ( t)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : ROL0
Dip Time : 10±0.5sec.
No mechanical damage
Remaining terminal electrode : 75% min.
Appearance: No significant abnormality.
Inductance change: Within ± 10%.
Preheating Dipping
260°C
150°C
Natural
cooling
60
seconds
10±0.5
seconds
Solderability
More than 95% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : ROL0
Dip Time : 4±1sec.
60
seconds
4¡À1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Size
L201610
Force (Kfg)
1.0
Time (sec)
> 30
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60(+5) Sec
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
7. RELIABILITY & TEST CONDITION :
L201610 SERIES
TEST CONDITION
Size
L201610
mm (inches)
1.40(0.055)
P-Kgf
1.0
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces
applied on the right condition.
R0.5(0.02)
1.0(0.039)
Chip
A
Random Vibration Test
Appearance : Cracking, Chipping & any other
defects harmful to the characteristics should
not be allowed.
Inductance: within±30%
No mechanical damage
Inductance change : within±10%
Frequency : 10-55-10Hz for 15 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 15 mins
This cycle shall be performed 12 times in each of three
mutually perpendicular direction.(Total 9 hours)
Drop 10 times on a concrete floor from a
height of 75cm.
Temperature : 105±2°C
Applied Current : rated current
Duration : 1008±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 504±8hrs
Measured at room temperature after placing for 2 to 3hrs.
Drop
Life testing at high temperature Appearance : No damage.
Inductance : Within ±10% of initial value.
Temperature
Humidity
Thermal Shock
Appearance : No damage.
Inductance : Within ±10% of initial value.
Phase
1
2
3
Temperature (°C)
-40±2°C
room temp
+105±2°C
Times (min.)
30±5
<0.5
30±5
Condition for 1 cycle
Step1 : -40±2°C 30±5 min.
Step2 : +105±5°C 30±5 min.
Number of cycles : 500
Measured at room temperature after placing for 2 to 3hrs.
Measured : 500 times
Low temperature storage test
Appearance : No damage.
Inductance : Within ±30% of initial value.
Temperature : -40±2°C
Duration : 500±8hrs
Measured at room temperature after placing for 2 to 3hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP INDUCTORS
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
3.0
1.0
L201610 SERIES
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 4~5 secs.
c) Never contact the ceramic with the iron tip
Preheating
Soldering
Natural
cooling
TEMPERATURE °C
20 ~ 40s
260
217
200
150
60~150s
60~180s
25
480s max.
Time (sec)
Reflow 3 times max.
Figure 1. Re-flow Soldering (Pb Free)
Preheating
Soldering
4~5 sec
(max.)
1.6
TEMPERATURE °C
Natural
cooling
350
330
150
Over 1min.
Gradual
Cooling
Figure 2. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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