IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Control type | ENABLE HIGH |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.024 A |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 22 mA |
| Prop。Delay @ Nom-Sup | 18 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| SN74LS126AJ | SN74LS126ADR2 | 54LS125A/BCBJC | 54LS125A/BDAJC | SN74LS126AJD | SN74LS125ANDS | SN74LS125AJD | AER23-23-12CB/S | SN74LS126ANDS | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,SOP,14PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | AER Forged Heat Sinks | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - | incompatible |
| Maker | NXP | - | NXP | NXP | NXP | NXP | NXP | - | NXP |
| package instruction | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | - | unknown |
| Control type | ENABLE HIGH | ENABLE HIGH | ENABLE LOW | ENABLE LOW | ENABLE HIGH | ENABLE LOW | ENABLE LOW | - | ENABLE HIGH |
| JESD-30 code | R-XDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | - | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.024 A | 0.024 A | - | 0.024 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | - | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | - | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | DFP | DIP | DIP | DIP | - | DIP |
| Encapsulate equivalent code | DIP14,.3 | SOP14,.25 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| surface mount | NO | YES | NO | YES | NO | NO | NO | - | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | - | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
京公网安备 11010802033920号
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