SN74LS126AJD datasheet, PDF - EEWORLD Datasheet

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SN74LS126AJD: DescriptionIC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC; Categorylogic logic; File Size118KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SN74LS126AJD Overview

IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC

SN74LS126AJD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
Control type	ENABLE HIGH
series	LS
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
length	19.495 mm
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.024 A
Number of digits	4
Number of functions	1
Number of ports	2
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
propagation delay (tpd)	18 ns
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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Description	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,SOP,14PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC	AER Forged Heat Sinks	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC	IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible
Maker	NXP	-	NXP	NXP	NXP	NXP	-	NXP	NXP
package instruction	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3	-	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	-	unknown	unknown
Control type	ENABLE HIGH	ENABLE HIGH	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	-	ENABLE HIGH	ENABLE HIGH
JESD-30 code	R-XDIP-T14	R-PDSO-G14	R-XDIP-T14	R-XDFP-F14	R-PDIP-T14	R-XDIP-T14	-	R-PDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0	-	e0	e0
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.024 A	0.024 A	0.012 A	0.012 A	0.024 A	0.024 A	-	0.024 A	0.024 A
Number of digits	4	4	4	4	4	4	-	4	4
Number of functions	1	1	1	1	1	1	-	1	1
Number of terminals	14	14	14	14	14	14	-	14	14
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C	70 °C	70 °C	-	70 °C	70 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	-	TRUE	TRUE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	-	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	SOP	DIP	DFP	DIP	DIP	-	DIP	DIP
Encapsulate equivalent code	DIP14,.3	SOP14,.25	DIP14,.3	FL14,.3	DIP14,.3	DIP14,.3	-	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	-	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V
surface mount	NO	YES	NO	YES	NO	NO	-	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	-	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL

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