
High-Performance Dual 150mA LDO 1.6mm x 1.6mm Thin MLF®
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| package instruction | HVSON, SOLCC6,.06,20 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Adjustability | FIXED |
| Maximum drop-back voltage 1 | 0.31 V |
| Nominal dropback voltage 1 | 0.155 V |
| Maximum drop-back voltage 2 | 0.31 V |
| Maximum absolute input voltage | 6 V |
| Maximum input voltage | 5.5 V |
| Minimum input voltage | 4.3 V |
| JESD-30 code | S-PDSO-N6 |
| JESD-609 code | e4 |
| length | 1.6 mm |
| Maximum grid adjustment rate | 0.01188% |
| Maximum load regulation | 0.033% |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Output times | 2 |
| Number of terminals | 6 |
| Working temperatureTJ-Max | 125 °C |
| Operating temperatureTJ-Mi | -40 °C |
| Maximum output voltage 1 | 3.399 V |
| Minimum output voltage 1 | 3.201 V |
| Nominal output voltage 1 | 3 V |
| Maximum output voltage 2 | 3.09 V |
| Minimum output voltage 2 | 2.91 V |
| Nominal output voltage 2 | 3 V |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC6,.06,20 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Regulator type | FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR |
| Maximum seat height | 0.6 mm |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| Maximum voltage tolerance | 3% |
| width | 1.6 mm |
| Base Number Matches | 1 |
