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FM25V02

Description
SPECIALTY MEMORY CIRCUIT, PDSO8
Categorystorage   
File Size334KB,17 Pages
ManufacturerRamtron International Corporation (Cypress Semiconductor Corporation)
Websitehttp://www.cypress.com/
Download Datasheet Parametric Compare View All

FM25V02 Overview

SPECIALTY MEMORY CIRCUIT, PDSO8

FM25V02 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2 V
Rated supply voltage3.3 V
Processing package description4 × 4.50 MM, 0.95 MM PITCH, GREEN, TDFN-8
Lead-freeYes
EU RoHS regulationsYes
stateTRANSFERRED
packaging shapeRectangle
Package SizeSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.9500 mm
terminal coatingMATTE Tin
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width8
organize32K × 8
storage density262144 deg
operating modeSynchronize
Number of digits32768 words
Number of digits32K
Memory IC typememory circuit
Pre-Production
FM25V02
256Kb Serial 3V F-RAM Memory
Features
256K bit Ferroelectric Nonvolatile RAM
Organized as 32,768 x 8 bits
High Endurance 100 Trillion (10
14
) Read/Writes
10 Year Data Retention
NoDelay™ Writes
Advanced High-Reliability Ferroelectric Process
Very Fast Serial Peripheral Interface - SPI
Up to 40 MHz Frequency
Direct Hardware Replacement for Serial Flash
SPI Mode 0 & 3 (CPOL, CPHA=0,0 & 1,1)
Write Protection Scheme
Hardware Protection
Software Protection
Device ID and Serial Number
Device ID reads out Manufacturer ID & Part ID
Unique Serial Number (FM25VN02)
Low Voltage, Low Power
Low Voltage Operation 2.0V – 3.6V
90
µA
Standby Current (typ.)
5
µA
Sleep Mode Current (typ.)
Industry Standard Configurations
Industrial Temperature -40°C to +85°C
8-pin “Green”/RoHS SOIC Package
8-pin “Green”/RoHS TDFN Package
Description
The FM25V02 is a 256-kilobit nonvolatile memory
employing an advanced ferroelectric process. A
ferroelectric random access memory or F-RAM is
nonvolatile and performs reads and writes like a
RAM. It provides reliable data retention for 10 years
while eliminating the complexities, overhead, and
system level reliability problems caused by Serial
Flash and other nonvolatile memories.
Unlike Serial Flash, the FM25V02 performs write
operations at bus speed. No write delays are incurred.
Data is written to the memory array immediately
after it has been transferred to the device. The next
bus cycle may commence without the need for data
polling. The product offers very high write
endurance, orders of magnitude more endurance than
Serial Flash. Also, F-RAM exhibits lower power
consumption than Serial Flash.
These capabilities make the FM25V02 ideal for
nonvolatile memory applications requiring frequent
or rapid writes or low power operation. Examples
range from data collection, where the number of
write cycles may be critical, to demanding industrial
controls where the long write time of Serial Flash can
cause data loss.
The FM25V02 provides substantial benefits to users
of Serial Flash as a hardware drop-in replacement.
The devices use the high-speed SPI bus, which
enhances the high-speed write capability of F-RAM
technology. The FM25VN02 is offered with a unique
This is a product in the pre-production phase of development. Device
characterization is complete and Ramtron does not expect to change the
specifications. Ramtron will issue a Product Change Notice if any
specification changes are made.
Rev. 2.0
May 2010
serial number that is read-only and can be used to
identify a board or system. Both devices incorporate
a read-only Device ID that allows the host to
determine the manufacturer, product density, and
product revision. The devices are guaranteed over an
industrial temperature range of -40°C to +85°C.
Pin Configuration
S
Q
W
VSS
1
2
3
4
8
7
6
5
VDD
HOLD
C
D
/S
Q
/W
VSS
1
2
3
4
8
7
6
5
VDD
/HOLD
C
D
Top View
Pin Name
/S
/W
/HOLD
C
D
Q
VDD
VSS
Function
Chip Select
Write Protect
Hold
Serial Clock
Serial Data Input
Serial Data Output
Supply Voltage
Ground
Ramtron International Corporation
1850 Ramtron Drive, Colorado Springs, CO 80921
(800) 545-FRAM, (719) 481-7000
http://www.ramtron.com
Page 1 of 17

FM25V02 Related Products

FM25V02 FM25V02-DG FM25V02-DGTR FM25VN02-G FM25VN02-GTR
Description SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 Cel 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 Cel -40 °C -40 °C -40 °C -40 °C
surface mount Yes YES YES YES YES
Terminal form NO NO LEAD NO LEAD GULL WING GULL WING
Terminal location pair DUAL DUAL DUAL DUAL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 8 8 8 8 8
organize 32K × 8 32KX8 32KX8 32KX8 32KX8
Is it lead-free? - Lead free Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Maker - Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging code - DFN DFN SOIC SOIC
package instruction - HVSON, SOLCC8,.16,37 HVSON, SOLCC8,.16,37 SOP, SOP8,.25 SOP, SOP8,.25
Contacts - 8 8 8 8
Reach Compliance Code - unknow unknow unknow unknow
JESD-30 code - R-PDSO-N8 R-PDSO-N8 R-PDSO-G8 R-PDSO-G8
JESD-609 code - e3 e3 e3 e3
length - 4.5 mm 4.5 mm 4.9 mm 4.9 mm
memory density - 262144 bi 262144 bi 262144 bi 262144 bi
Memory IC Type - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
Humidity sensitivity level - 1 1 1 1
word count - 32768 words 32768 words 32768 words 32768 words
character code - 32000 32000 32000 32000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - HVSON HVSON SOP SOP
Encapsulate equivalent code - SOLCC8,.16,37 SOLCC8,.16,37 SOP8,.25 SOP8,.25
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) - 260 260 260 260
power supply - 3.3 V 3.3 V 3.3 V 3.3 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 0.85 mm 0.85 mm 1.75 mm 1.75 mm
Maximum standby current - 0.00015 A 0.00015 A 0.00015 A 0.00015 A
Maximum slew rate - 0.0025 mA 0.0025 mA 0.0025 mA 0.0025 mA
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V
technology - CMOS CMOS CMOS CMOS
Terminal surface - MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal pitch - 0.95 mm 0.95 mm 1.27 mm 1.27 mm
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 4 mm 4 mm 3.9 mm 3.9 mm
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