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FM25VN02-G

Description
SPECIALTY MEMORY CIRCUIT, PDSO8
Categorystorage    storage   
File Size334KB,17 Pages
ManufacturerRamtron International Corporation (Cypress Semiconductor Corporation)
Websitehttp://www.cypress.com/
Environmental Compliance
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FM25VN02-G Overview

SPECIALTY MEMORY CIRCUIT, PDSO8

FM25VN02-G Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRamtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density262144 bi
Memory IC TypeMEMORY CIRCUIT
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum standby current0.00015 A
Maximum slew rate0.0025 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Pre-Production
FM25V02
256Kb Serial 3V F-RAM Memory
Features
256K bit Ferroelectric Nonvolatile RAM
Organized as 32,768 x 8 bits
High Endurance 100 Trillion (10
14
) Read/Writes
10 Year Data Retention
NoDelay™ Writes
Advanced High-Reliability Ferroelectric Process
Very Fast Serial Peripheral Interface - SPI
Up to 40 MHz Frequency
Direct Hardware Replacement for Serial Flash
SPI Mode 0 & 3 (CPOL, CPHA=0,0 & 1,1)
Write Protection Scheme
Hardware Protection
Software Protection
Device ID and Serial Number
Device ID reads out Manufacturer ID & Part ID
Unique Serial Number (FM25VN02)
Low Voltage, Low Power
Low Voltage Operation 2.0V – 3.6V
90
µA
Standby Current (typ.)
5
µA
Sleep Mode Current (typ.)
Industry Standard Configurations
Industrial Temperature -40°C to +85°C
8-pin “Green”/RoHS SOIC Package
8-pin “Green”/RoHS TDFN Package
Description
The FM25V02 is a 256-kilobit nonvolatile memory
employing an advanced ferroelectric process. A
ferroelectric random access memory or F-RAM is
nonvolatile and performs reads and writes like a
RAM. It provides reliable data retention for 10 years
while eliminating the complexities, overhead, and
system level reliability problems caused by Serial
Flash and other nonvolatile memories.
Unlike Serial Flash, the FM25V02 performs write
operations at bus speed. No write delays are incurred.
Data is written to the memory array immediately
after it has been transferred to the device. The next
bus cycle may commence without the need for data
polling. The product offers very high write
endurance, orders of magnitude more endurance than
Serial Flash. Also, F-RAM exhibits lower power
consumption than Serial Flash.
These capabilities make the FM25V02 ideal for
nonvolatile memory applications requiring frequent
or rapid writes or low power operation. Examples
range from data collection, where the number of
write cycles may be critical, to demanding industrial
controls where the long write time of Serial Flash can
cause data loss.
The FM25V02 provides substantial benefits to users
of Serial Flash as a hardware drop-in replacement.
The devices use the high-speed SPI bus, which
enhances the high-speed write capability of F-RAM
technology. The FM25VN02 is offered with a unique
This is a product in the pre-production phase of development. Device
characterization is complete and Ramtron does not expect to change the
specifications. Ramtron will issue a Product Change Notice if any
specification changes are made.
Rev. 2.0
May 2010
serial number that is read-only and can be used to
identify a board or system. Both devices incorporate
a read-only Device ID that allows the host to
determine the manufacturer, product density, and
product revision. The devices are guaranteed over an
industrial temperature range of -40°C to +85°C.
Pin Configuration
S
Q
W
VSS
1
2
3
4
8
7
6
5
VDD
HOLD
C
D
/S
Q
/W
VSS
1
2
3
4
8
7
6
5
VDD
/HOLD
C
D
Top View
Pin Name
/S
/W
/HOLD
C
D
Q
VDD
VSS
Function
Chip Select
Write Protect
Hold
Serial Clock
Serial Data Input
Serial Data Output
Supply Voltage
Ground
Ramtron International Corporation
1850 Ramtron Drive, Colorado Springs, CO 80921
(800) 545-FRAM, (719) 481-7000
http://www.ramtron.com
Page 1 of 17

FM25VN02-G Related Products

FM25VN02-G FM25V02 FM25V02-DG FM25V02-DGTR FM25VN02-GTR
Description SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 Cel -40 °C -40 °C -40 °C
organize 32KX8 32K × 8 32KX8 32KX8 32KX8
surface mount YES Yes YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING NO NO LEAD NO LEAD GULL WING
Terminal location DUAL pair DUAL DUAL DUAL
Is it lead-free? Lead free - Lead free Lead free Lead free
Is it Rohs certified? conform to - conform to conform to conform to
Maker Ramtron International Corporation (Cypress Semiconductor Corporation) - Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation)
Parts packaging code SOIC - DFN DFN SOIC
package instruction SOP, SOP8,.25 - HVSON, SOLCC8,.16,37 HVSON, SOLCC8,.16,37 SOP, SOP8,.25
Contacts 8 - 8 8 8
Reach Compliance Code unknow - unknow unknow unknow
JESD-30 code R-PDSO-G8 - R-PDSO-N8 R-PDSO-N8 R-PDSO-G8
JESD-609 code e3 - e3 e3 e3
length 4.9 mm - 4.5 mm 4.5 mm 4.9 mm
memory density 262144 bi - 262144 bi 262144 bi 262144 bi
Memory IC Type MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
Humidity sensitivity level 1 - 1 1 1
word count 32768 words - 32768 words 32768 words 32768 words
character code 32000 - 32000 32000 32000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - HVSON HVSON SOP
Encapsulate equivalent code SOP8,.25 - SOLCC8,.16,37 SOLCC8,.16,37 SOP8,.25
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 - 260 260 260
power supply 3.3 V - 3.3 V 3.3 V 3.3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm - 0.85 mm 0.85 mm 1.75 mm
Maximum standby current 0.00015 A - 0.00015 A 0.00015 A 0.00015 A
Maximum slew rate 0.0025 mA - 0.0025 mA 0.0025 mA 0.0025 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2 V - 2 V 2 V 2 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V
technology CMOS - CMOS CMOS CMOS
Terminal surface MATTE TIN - MATTE TIN MATTE TIN MATTE TIN
Terminal pitch 1.27 mm - 0.95 mm 0.95 mm 1.27 mm
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm - 4 mm 4 mm 3.9 mm

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