Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, PDIP8,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Datalinear |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 14000 µV |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Supply voltage upper limit | 20 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| SP3-2515-5 | SP2-2515-5 | SP4-2510-2 | SP7-2510-2 | SP2-2512-2 | SP7-2512-2 | |
|---|---|---|---|---|---|---|
| Description | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, PDIP8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, MBCY8, | Operational Amplifier, 1 Func, 11000uV Offset-Max, BIPolar, CQCC20, | Operational Amplifier, 1 Func, 11000uV Offset-Max, BIPolar, CDIP8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, MBCY8, | Operational Amplifier, 1 Func, 14000uV Offset-Max, BIPolar, CDIP8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Datalinear | Datalinear | Datalinear | Datalinear | Datalinear | Datalinear |
| package instruction | DIP, DIP8,.3 | , CAN8,.23 | QCCN, LCC20,.35SQ | DIP, DIP8,.3 | , CAN8,.23 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES | YES | YES | YES |
| Maximum input offset voltage | 14000 µV | 14000 µV | 11000 µV | 11000 µV | 14000 µV | 14000 µV |
| JESD-30 code | R-PDIP-T8 | O-MBCY-W8 | S-XQCC-N20 | R-XDIP-T8 | O-MBCY-W8 | R-XDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| low-dissonance | NO | NO | NO | NO | NO | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 20 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | METAL | CERAMIC | CERAMIC | METAL | CERAMIC |
| Encapsulate equivalent code | DIP8,.3 | CAN8,.23 | LCC20,.35SQ | DIP8,.3 | CAN8,.23 | DIP8,.3 |
| Package shape | RECTANGULAR | ROUND | SQUARE | RECTANGULAR | ROUND | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | CHIP CARRIER | IN-LINE | CYLINDRICAL | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Supply voltage upper limit | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | WIRE | NO LEAD | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| Terminal location | DUAL | BOTTOM | QUAD | DUAL | BOTTOM | DUAL |
| encapsulated code | DIP | - | QCCN | DIP | - | DIP |
| surface mount | NO | - | YES | NO | - | NO |
| Terminal pitch | 2.54 mm | - | 1.27 mm | 2.54 mm | - | 2.54 mm |
京公网安备 11010802033920号
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