DS1730YL-150-IND datasheet, PDF

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DS1730YL-150-IND: DescriptionNon-Volatile SRAM, 32KX8, 150ns, CMOS,; Categorystorage storage; File Size305KB，12 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS1730YL-150-IND Overview

Non-Volatile SRAM, 32KX8, 150ns, CMOS,

DS1730YL-150-IND Parametric

Parameter Name	Attribute value
Maker	DALLAS
Reach Compliance Code	unknown
Maximum access time	150 ns
memory density	262144 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of terminals	34
word count	32768 words
character code	32000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
Encapsulate equivalent code	MODULE,34LEAD,1.0
Package form	MICROELECTRONIC ASSEMBLY
power supply	3/3.3 V
Certification status	Not Qualified
Maximum standby current	0.004 A
Maximum slew rate	0.04 mA
technology	CMOS
Temperature level	INDUSTRIAL

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DS1730YL-150-IND Related Products

	DS1730YL-150-IND	DS1730YL-200-IND	DS1730Y-200	DS1730Y-150	DS1730YL-150	DS1730YL-200
Description	Non-Volatile SRAM, 32KX8, 150ns, CMOS,	Non-Volatile SRAM, 32KX8, 200ns, CMOS,	Non-Volatile SRAM Module, 32KX8, 200ns, CMOS,	Non-Volatile SRAM Module, 32KX8, 150ns, CMOS,	Non-Volatile SRAM, 32KX8, 150ns, CMOS,	Non-Volatile SRAM, 32KX8, 200ns, CMOS,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	150 ns	200 ns	200 ns	150 ns	150 ns	200 ns
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8	8	8	8	8
Number of terminals	34	34	28	28	34	34
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	MODULE,34LEAD,1.0	MODULE,34LEAD,1.0	DIP28,.6	DIP28,.6	MODULE,34LEAD,1.0	MODULE,34LEAD,1.0
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	IN-LINE	IN-LINE	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Maximum slew rate	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA	0.04 mA
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maker	DALLAS	-	-	DALLAS	DALLAS	DALLAS

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