Non-Volatile SRAM, 32KX8, 200ns, CMOS,
| Parameter Name | Attribute value |
| Maker | DALLAS |
| Reach Compliance Code | unknown |
| Maximum access time | 200 ns |
| memory density | 262144 bit |
| Memory IC Type | NON-VOLATILE SRAM |
| memory width | 8 |
| Number of terminals | 34 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| Encapsulate equivalent code | MODULE,34LEAD,1.0 |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.004 A |
| Maximum slew rate | 0.04 mA |
| technology | CMOS |
| Temperature level | COMMERCIAL |

| DS1730YL-200 | DS1730YL-200-IND | DS1730Y-200 | DS1730Y-150 | DS1730YL-150 | DS1730YL-150-IND | |
|---|---|---|---|---|---|---|
| Description | Non-Volatile SRAM, 32KX8, 200ns, CMOS, | Non-Volatile SRAM, 32KX8, 200ns, CMOS, | Non-Volatile SRAM Module, 32KX8, 200ns, CMOS, | Non-Volatile SRAM Module, 32KX8, 150ns, CMOS, | Non-Volatile SRAM, 32KX8, 150ns, CMOS, | Non-Volatile SRAM, 32KX8, 150ns, CMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 200 ns | 200 ns | 200 ns | 150 ns | 150 ns | 150 ns |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 34 | 34 | 28 | 28 | 34 | 34 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | MODULE,34LEAD,1.0 | MODULE,34LEAD,1.0 | DIP28,.6 | DIP28,.6 | MODULE,34LEAD,1.0 | MODULE,34LEAD,1.0 |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| Maximum slew rate | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Maker | DALLAS | - | - | DALLAS | DALLAS | DALLAS |