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DS1730YL-200

Description
Non-Volatile SRAM, 32KX8, 200ns, CMOS,
Categorystorage    storage   
File Size305KB,12 Pages
ManufacturerDALLAS
Websitehttp://www.dalsemi.com
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DS1730YL-200 Overview

Non-Volatile SRAM, 32KX8, 200ns, CMOS,

DS1730YL-200 Parametric

Parameter NameAttribute value
MakerDALLAS
Reach Compliance Codeunknown
Maximum access time200 ns
memory density262144 bit
Memory IC TypeNON-VOLATILE SRAM
memory width8
Number of terminals34
word count32768 words
character code32000
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Package body materialPLASTIC/EPOXY
Encapsulate equivalent codeMODULE,34LEAD,1.0
Package formMICROELECTRONIC ASSEMBLY
power supply3/3.3 V
Certification statusNot Qualified
Maximum standby current0.004 A
Maximum slew rate0.04 mA
technologyCMOS
Temperature levelCOMMERCIAL
This Material Copyrighted By Its Respective Manufacturer

DS1730YL-200 Related Products

DS1730YL-200 DS1730YL-200-IND DS1730Y-200 DS1730Y-150 DS1730YL-150 DS1730YL-150-IND
Description Non-Volatile SRAM, 32KX8, 200ns, CMOS, Non-Volatile SRAM, 32KX8, 200ns, CMOS, Non-Volatile SRAM Module, 32KX8, 200ns, CMOS, Non-Volatile SRAM Module, 32KX8, 150ns, CMOS, Non-Volatile SRAM, 32KX8, 150ns, CMOS, Non-Volatile SRAM, 32KX8, 150ns, CMOS,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Maximum access time 200 ns 200 ns 200 ns 150 ns 150 ns 150 ns
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM NON-VOLATILE SRAM
memory width 8 8 8 8 8 8
Number of terminals 34 34 28 28 34 34
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000
Maximum operating temperature 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
Encapsulate equivalent code MODULE,34LEAD,1.0 MODULE,34LEAD,1.0 DIP28,.6 DIP28,.6 MODULE,34LEAD,1.0 MODULE,34LEAD,1.0
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY IN-LINE IN-LINE MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Maker DALLAS - - DALLAS DALLAS DALLAS

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