ES52C1B25N-12.288M
Series
RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD
3.3Vdc Clipped Sinewave TC(VC)XO
Operating Temperature Range
0°C to +70°C
Frequency Stability
±2.5ppm Maximum
RoHS
Pb
ES52C1 B 25 N -12.288M
Nominal Frequency
12.288MHz
Control Voltage
None (No Connect on Pin 1)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Stability vs. Frequency
Tolerance
Frequency Stability
Frequency Stability vs. Input Voltage
Frequency Stability vs. Aging
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage
Load Drive Capability
Output Logic Type
Control Voltage
Phase Noise
Start Up Time
Storage Temperature Range
12.288MHz
±1.0ppm Maximum (Measured at 25°C ±2°C, Vdd=3.3Vdc, Vc=1.5Vdc)
±2.5ppm Maximum
±0.2ppm Maximum (Vdd ±5%)
±1ppm/Year Maximum (at 25°C)
±0.2ppm Maximum (±1kOhm//±1pF)
0°C to +70°C
3.3Vdc ±5%
1.5mA Maximum
0.8Vp-p Clipped Sinewave Minimum
10kOhms//10pF
Clipped Sinewave
None (No Connect on Pin 1)
-80dBc/Hz at 10Hz offset, -115dBc/Hz at 100Hz offset, -135dBc/Hz at 1kHz offset, -145dBc/Hz at 10kHz
offset, -145dBc/Hz at 100kHz offset (Typical Values, at 12.800MHz)
5mSec Maximum
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 1 of 4
ES52C1B25N-12.288M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
CONNECTION
No Connect
Do Not Connect
Do Not Connect
Do Not Connect
Case/Ground
Output
Do Not Connect
Do Not Connect
Do Not Connect
Supply Voltage
5.0
±0.2
MARKING
ORIENTATION
2.0
MAX
0.3
±0.1
(x10)
0.8 ±0.1
(x4)
5
6
1.4 ±0.1
(x4)
3
4
5
6
7
8
9
7.0
±0.2
1
2.0 ±0.1
(x4)
10
2.7 ±0.1
(x4)
10
LINE MARKING
1
2
E12.288
E=Ecliptek
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.8 (X4)
3.9
Solder Land
(X4)
3.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 2 of 4
ES52C1B25N-12.288M
OUTPUT WAVEFORM
CLOCK OUTPUT
0V
DC
V
P-P
Test Circuit for No Connect Option
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.1µF
(Note 1)
Ground
R
L
= 10kOhms
C
L
= 10pF
(Note 3)
No Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 3 of 4
ES52C1B25N-12.288M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 220°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
220°C Maximum
220°C Maximum 1 Time / 215°C Maximum 1 Time
15 seconds Maximum 1 Time / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 4 of 4
Embedded System
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