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MB81C1000A-10LPJ

Description
Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20
Categorystorage    storage   
File Size677KB,25 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MB81C1000A-10LPJ Overview

Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20

MB81C1000A-10LPJ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFUJITSU
Parts packaging codeSOJ
package instructionSOJ, SOJ20/26,.34
Contacts20
Reach Compliance Codeunknown
Maximum access time100 ns
I/O typeSEPARATE
JESD-30 codeR-PDSO-J20
JESD-609 codee0
memory density1048576 bit
Memory IC TypeFAST PAGE DRAM
memory width1
Number of terminals20
word count1048576 words
character code1000000
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ20/26,.34
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum standby current0.00025 A
Maximum slew rate0.054 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL

MB81C1000A-10LPJ Related Products

MB81C1000A-10LPJ MB81C1000A-80LPFTR MB81C1000A-70LPFTN MB81C1000A-80LP MB81C1000A-80LPJ MB81C1000A-80LPSZ MB81C1000A-80LPFTN MB81C1000A-10LP MB81C1000A-70LP
Description Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 70ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDIP18 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20 Fast Page DRAM, 1MX1, 100ns, CMOS, PDIP18 Fast Page DRAM, 1MX1, 70ns, CMOS, PDIP18
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOJ SOIC SOIC DIP SOJ ZIP SOIC DIP DIP
package instruction SOJ, SOJ20/26,.34 TSSOP, TSSOP20/24,.63,20 TSSOP, TSSOP20/24,.63,20 DIP, DIP18,.3 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 TSSOP, TSSOP20/24,.63,20 DIP, DIP18,.3 DIP, DIP18,.3
Contacts 20 20 20 18 20 20 20 18 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 100 ns 80 ns 70 ns 80 ns 80 ns 80 ns 80 ns 100 ns 70 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PDSO-J20 R-PDSO-G20 R-PDSO-G20 R-PDIP-T18 R-PDSO-J20 R-PZIP-T20 R-PDSO-G20 R-PDIP-T18 R-PDIP-T18
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 1 1 1 1 1 1 1 1 1
Number of terminals 20 20 20 18 20 20 20 18 18
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ TSSOP TSSOP DIP SOJ ZIP TSSOP DIP DIP
Encapsulate equivalent code SOJ20/26,.34 TSSOP20/24,.63,20 TSSOP20/24,.63,20 DIP18,.3 SOJ20/26,.34 ZIP20,.1 TSSOP20/24,.63,20 DIP18,.3 DIP18,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512
Maximum standby current 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A 0.00025 A
Maximum slew rate 0.054 mA 0.062 mA 0.068 mA 0.062 mA 0.062 mA 0.062 mA 0.062 mA 0.054 mA 0.068 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING GULL WING THROUGH-HOLE J BEND THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 0.5 mm 0.5 mm 2.54 mm 1.27 mm 1.27 mm 0.5 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL ZIG-ZAG DUAL DUAL DUAL
Maker FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU - -
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