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AS7C251MFT18A-10TQIN

Description
2.5V 1M x 18 flowthrough burst synchronous SRAM
Categorystorage    storage   
File Size494KB,19 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Environmental Compliance
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AS7C251MFT18A-10TQIN Overview

2.5V 1M x 18 flowthrough burst synchronous SRAM

AS7C251MFT18A-10TQIN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time10 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)83 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density18874368 bi
Memory IC TypeSTANDARD SRAM
memory width18
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)245
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.04 A
Minimum standby current2.38 V
Maximum slew rate0.23 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
December 2004
®
AS7C251MFT18A
2.5V 1M x 18 flowthrough burst synchronous SRAM
Features
Organization: 1,048,576 words x18 bits
Fast clock to data access: 7.5/8.5/10 ns
Fast OE access time: 3.5/4.0 ns
Fully synchronous flow-through operation
Asynchronous output enable control
Available 100-pin TQFP package
Individual byte write and global write
Multiple chip enables for easy expansion
2.5V core power supply
Linear or interleaved burst control
Snooze mode for reduced power-standby
Logic block diagram
LBO
CLK
ADV
ADSC
ADSP
A[19:0]
CLK
CS
CLR
Burst logic
Q
20
CS
Address
D
20
18 20
1M
x
18
Memory
array
18
18
register
CLK
GWE
BW
b
BWE
BW
a
CE0
CE1
CE2
D
DQb
Q
CLK
D
DQa
Q
Byte Write
registers
Byte Write
registers
CLK
D
2
OE
CE
CLK
D
ZZ
Enable
register
Q
Output
buffers
Input
registers
CLK
Power
down
Enable
Q
delay
register
CLK
OE
18
DQ[a,b]
Selection guide
-75
Minimum cycle time
Maximum clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
8.5
7.5
275
90
60
-85
10
8.5
250
80
60
-10
12
10
230
80
60
Units
ns
ns
mA
mA
mA
12/24/04, v. 1.2
Alliance Semiconductor
1 of 19
Copyright © Alliance Semiconductor. All rights reserved.

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Description 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM 2.5V 1M x 18 flowthrough burst synchronous SRAM
Is it Rohs certified? conform to - conform to incompatible incompatible incompatible conform to
Maker ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Parts packaging code QFP - QFP QFP QFP QFP QFP
package instruction LQFP, QFP100,.63X.87 - LQFP, LQFP, LQFP, LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87
Contacts 100 - 100 100 100 100 100
Reach Compliance Code unknow - unknow unknow unknow unknow unknow
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 10 ns - 7.5 ns 7.5 ns 7.5 ns 8.5 ns 8.5 ns
Other features FLOW-THROUGH ARCHITECTURE - FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 code R-PQFP-G100 - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e3 - e3 e0 e0 e0 e3
length 20 mm - 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 18874368 bi - 18874368 bi 18874368 bi 18874368 bi 18874368 bi 18874368 bi
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 18 - 18 18 18 18 18
Number of functions 1 - 1 1 1 1 1
Number of terminals 100 - 100 100 100 100 100
word count 1048576 words - 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 - 1000000 1000000 1000000 1000000 1000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - 70 °C 70 °C 85 °C 70 °C 70 °C
organize 1MX18 - 1MX18 1MX18 1MX18 1MX18 1MX18
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP - LQFP LQFP LQFP LQFP LQFP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 245 - 245 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 245
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm - 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 2.625 V - 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V - 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES - YES YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface MATTE TIN - MATTE TIN TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) MATTE TIN
Terminal form GULL WING - GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD - QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 - 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
width 14 mm - 14 mm 14 mm 14 mm 14 mm 14 mm
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