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R5F21336DDFP Overview

RENESAS MCU

R5F21336DDFP Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionLQFP,
Contacts32
Reach Compliance Codecompli
Has ADCYES
Other featuresIT ALSO OPERATES 1.8 V AT 5MHZ
Address bus width
bit size8
maximum clock frequency20 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G32
length7 mm
Number of I/O lines28
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Certification statusNot Qualified
ROM programmabilityFLASH
Maximum seat height1.7 mm
speed20 MHz
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1
Datasheet
R8C/33D Group
RENESAS MCU
REJ03B0287-0100
Rev.1.00
Mar 31, 2010
1.
1.1
Overview
Features
The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
REJ03B0287-0100 Rev.1.00
Mar 31, 2010
Page 1 of 42

R5F21336DDFP Related Products

R5F21336DDFP R5F21331DDFP R5F21331DNFP R5F21332DDFP R5F21332DNFP R5F21334DDFP R5F21334DNFP R5F21335DDFP R5F21335DNFP R5F21336DNFP
Description RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU RENESAS MCU
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction LQFP, LQFP, LQFP, QFP32,.35SQ,32 7 X 7 MM, 0.80 MM, PLASTIC, LQFP-32 LQFP, QFP32,.35SQ,32 LQFP, LQFP, QFP32,.35SQ,32 LQFP, 7 X 7 MM, 0.80 MM, PLASTIC, LQFP-32 LQFP, QFP32,.35SQ,32
Contacts 32 32 32 32 32 32 32 32 32 32
Reach Compliance Code compli compli compli compli compli compli compli compli compli compli
Has ADC YES YES YES YES YES YES YES YES YES YES
Other features IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ IT ALSO OPERATES 1.8 V AT 5MHZ
bit size 8 8 8 8 8 8 8 8 8 8
maximum clock frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
DAC channel NO NO NO NO NO NO NO NO NO NO
DMA channel NO NO NO NO NO NO NO NO NO NO
JESD-30 code S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32
length 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm
Number of I/O lines 28 28 28 28 28 28 28 28 28 28
Number of terminals 32 32 32 32 32 32 32 32 32 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -20 °C -40 °C -20 °C -40 °C -20 °C -40 °C -20 °C -20 °C
PWM channel YES YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm
speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER OTHER
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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