|
TMP82C55AP-2 |
TMP82C55AP-10 |
TMP82C55AM-10 |
TMP82C55AM-2 |
TMP82C55A |
| Description |
CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
- |
| Maker |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
- |
| Parts packaging code |
DIP |
DIP |
SSOP |
SSOP |
- |
| package instruction |
DIP, |
DIP, |
SSOP, |
SSOP, |
- |
| Contacts |
40 |
40 |
40 |
40 |
- |
| Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
- |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
| External data bus width |
8 |
8 |
8 |
8 |
- |
| JESD-30 code |
R-PDIP-T40 |
R-PDIP-T40 |
R-PDSO-G40 |
R-PDSO-G40 |
- |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
- |
| length |
50.7 mm |
50.7 mm |
17.5 mm |
17.5 mm |
- |
| Number of I/O lines |
24 |
24 |
24 |
24 |
- |
| Number of ports |
3 |
3 |
3 |
3 |
- |
| Number of terminals |
40 |
40 |
40 |
40 |
- |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
- |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
| encapsulated code |
DIP |
DIP |
SSOP |
SSOP |
- |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
| Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
- |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
| Maximum seat height |
4.8 mm |
4.8 mm |
2.8 mm |
2.8 mm |
- |
| Maximum slew rate |
5 mA |
5 mA |
5 mA |
5 mA |
- |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
- |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
- |
| surface mount |
NO |
NO |
YES |
YES |
- |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
- |
| Terminal pitch |
2.54 mm |
2.54 mm |
0.8 mm |
0.8 mm |
- |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| width |
15.24 mm |
15.24 mm |
8.8 mm |
8.8 mm |
- |
| uPs/uCs/peripheral integrated circuit type |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
PARALLEL IO PORT, GENERAL PURPOSE |
- |