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TMP82C55AM-10

Description
CMOS PROGRAMMABLE PERIPHERAL INTERFACE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size793KB,39 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TMP82C55AM-10 Overview

CMOS PROGRAMMABLE PERIPHERAL INTERFACE

TMP82C55AM-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Objectid1439437816
Parts packaging codeSSOP
package instructionSSOP,
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
compound_id11215490
External data bus width8
JESD-30 codeR-PDSO-G40
JESD-609 codee0
length17.5 mm
Number of I/O lines24
Number of ports3
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.8 mm
Maximum slew rate5 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.8 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE

TMP82C55AM-10 Related Products

TMP82C55AM-10 TMP82C55AP-10 TMP82C55AP-2 TMP82C55AM-2 TMP82C55A
Description CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE
Is it Rohs certified? incompatible incompatible incompatible incompatible -
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor -
Parts packaging code SSOP DIP DIP SSOP -
package instruction SSOP, DIP, DIP, SSOP, -
Contacts 40 40 40 40 -
Reach Compliance Code unknow unknow unknow unknow -
ECCN code EAR99 EAR99 EAR99 EAR99 -
External data bus width 8 8 8 8 -
JESD-30 code R-PDSO-G40 R-PDIP-T40 R-PDIP-T40 R-PDSO-G40 -
JESD-609 code e0 e0 e0 e0 -
length 17.5 mm 50.7 mm 50.7 mm 17.5 mm -
Number of I/O lines 24 24 24 24 -
Number of ports 3 3 3 3 -
Number of terminals 40 40 40 40 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SSOP DIP DIP SSOP -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE IN-LINE SMALL OUTLINE, SHRINK PITCH -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 2.8 mm 4.8 mm 4.8 mm 2.8 mm -
Maximum slew rate 5 mA 5 mA 5 mA 5 mA -
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage 5 V 5 V 5 V 5 V -
surface mount YES NO NO YES -
technology CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING -
Terminal pitch 0.8 mm 2.54 mm 2.54 mm 0.8 mm -
Terminal location DUAL DUAL DUAL DUAL -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width 8.8 mm 15.24 mm 15.24 mm 8.8 mm -
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE -
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