AS7C33512PFS18A-166TQIN datasheet, PDF

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AS7C33512PFS18A-166TQIN: Description3.3V 512K x 18 pipeline burst synchronous SRAM; Categorystorage storage; File Size494KB，20 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]; Environmental Compliance

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AS7C33512PFS18A-166TQIN Overview

3.3V 512K x 18 pipeline burst synchronous SRAM

AS7C33512PFS18A-166TQIN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	4 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
memory density	9437184 bi
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	245
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.475 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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November 2004

AS7C33512PFS18A

3.3V 512K

18 pipeline burst synchronous SRAM

Features

•

Organization: 524,288 words × 18 bits

Fast clock speeds to 166 MHz

Fast clock to data access: 3.5/4.0 ns

Fast OE access time: 3.5/4.0 ns

Fully synchronous register-to-register operation

Single-cycle deselect

Asynchronous output enable control

Available in 100-pin TQFP package

Individual byte write and global write

•

Multiple chip enables for easy expansion

3.3V core power supply

2.5V or 3.3V I/O operation with separate V

DDQ

30 mW typical standby power in power down mode

Linear or interleaved burst control

Snooze mode for reduced power-standby

Common data inputs and data outputs

Logic block diagram

LBO

CLK

ADV

ADSC

ADSP

A[18:0]

CLK

CLR

Burst logic

Address

CLK

17 19

512K × 18

Memory

array

GWE

BWE

CE0

CE1

CE2

DQb

CLK

DQa

Byte Write

registers

Byte Write

registers

CLK

Enable

Output

registers

CLK

Input

registers

CLK

Power

down

Enable

delay

CLK

DQ[a,b]

Selection guide

–166

Minimum cycle time

Maximum clock frequency

Maximum clock access time

Maximum operating current

Maximum standby current

Maximum CMOS standby current (DC)

166

3.5

475

130

–133

7.5

133

425

100

Units

MHz

11/30/04;

v.2.2

Alliance Semiconductor

1 of 20

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	AS7C33512PFS18A-166TQIN	AS7C33512PFS18A	AS7C33512PFS18A-133TQCN	AS7C33512PFS18A-166TQCN	AS7C33512PFS18A-166TQC	AS7C33512PFS18A-166TQI
Description	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM	3.3V 512K x 18 pipeline burst synchronous SRAM
Is it Rohs certified?	conform to	-	conform to	conform to	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP	-	QFP	QFP	QFP	QFP
package instruction	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	100	-	100	100	100	100
Reach Compliance Code	unknow	-	unknow	unknow	unknow	unknow
ECCN code	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	4 ns	-	4.5 ns	4 ns	4 ns	4 ns
Other features	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz	-	133 MHz	166 MHz	166 MHz	166 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e3	-	e3	e3	e0	e0
length	20 mm	-	20 mm	20 mm	20 mm	20 mm
memory density	9437184 bi	-	9437184 bi	9437184 bi	9437184 bi	9437184 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	18	-	18	18	18	18
Number of functions	1	-	1	1	1	1
Number of terminals	100	-	100	100	100	100
word count	524288 words	-	524288 words	524288 words	524288 words	524288 words
character code	512000	-	512000	512000	512000	512000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	70 °C	85 °C
organize	512KX18	-	512KX18	512KX18	512KX18	512KX18
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	245	-	245	245	NOT SPECIFIED	NOT SPECIFIED
power supply	2.5/3.3,3.3 V	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.03 A	-	0.03 A	0.03 A	0.03 A	0.03 A
Minimum standby current	3.14 V	-	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.475 mA	-	0.425 mA	0.475 mA	0.475 mA	0.475 mA
Maximum supply voltage (Vsup)	3.465 V	-	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	-	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	MATTE TIN	-	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	30	30	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm

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