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CYBL11471-56LQXI

Description
Multifunction Peripheral, CMOS, QFN-56
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,44 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
Download Datasheet Parametric Compare View All

CYBL11471-56LQXI Overview

Multifunction Peripheral, CMOS, QFN-56

CYBL11471-56LQXI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCypress Semiconductor
package instructionQFN-56
Reach Compliance Codecompliant
Address bus width
boundary scanNO
Bus compatibilityI2C; IDE; IRDA; LIN; SPI; UART
maximum clock frequency48 MHz
External data bus width
JESD-30 codeS-XQCC-N56
length7 mm
Number of I/O lines36
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (number of words)16384
Maximum seat height0.6 mm
Maximum supply voltage5.5 V
Minimum supply voltage1.71 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.4 mm
Terminal locationQUAD
width7 mm
PRoC™ BLE: CYBL1XX7X
Family Datasheet
Programmable Radio-on-Chip With
Bluetooth Low Energy
PRoC™ BLE is a 32-bit, 48-MHz ARM
®
Cortex
®
-M0 BLE solution with CapSense
®
, 12-bit ADC, four timer, counter, pulse-width
modulators (TCPWM), Direct memory access (DMA), thirty-six GPIOs, two serial communication blocks (SCBs), LCD, and I
2
S.
PRoC BLE includes a royalty-free BLE stack compatible with Bluetooth
®
4.2 and provides a complete, programmable, and flexible
solution for HID, remote controls, toys, beacons, and wireless chargers. In addition to these applications, PRoC BLE provides a
simple, low-cost way to add BLE connectivity to any system.
General Description
Features
Bluetooth
®
Smart Connectivity
Bluetooth 4.2 single-mode device
2.4-GHz BLE radio and baseband with integrated balun
TX output power: –18 dBm to +3 dBm
Received signal strength indicator (RSSI) with 1-dB resolution
RX sensitivity: –92 dBm
TX current: 15.6 mA at 0 dBm
RX current: 16.4 mA
Two serial communication blocks (SCBs) supporting I
2
C
(Master/Slave), SPI (Master/Slave), or UART
Four dedicated 16-bit TCPWMs
Additional four 8-bit or two 16-bit PWMs
Programmable LVD from 1.8 V to 4.5 V
I
2
S Master interface
Wide supply-voltage range: 1.9 V to 5.5 V
3-MHz to 48-MHz internal main oscillator (IMO) with 2%
accuracy
24-MHz external clock oscillator (ECO) without load
capacitance
32-kHz WCO
36 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z, or strong output
Any GPIO pin can be CapSense, LCD, or analog, with flexible
pin routing
2-pin SWD
In-system flash programming support
Operating temperature range: –40 °C to +105 °C
Available in 56-pin QFN (7 mm × 7 mm) and 76-ball WLCSP
(3.52 mm × 3.91 mm) packages
Easy-to-use IDE to configure, develop, program, and test a
BLE application
Option to export the design to Keil, IAR, or Eclipse
Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
Switches between Central and Peripheral roles on-the-go
Standard Bluetooth Low Energy profiles and services for
interoperability
Custom profile and service for specific use cases
Clock, Reset, and Supply
ARM Cortex-M0 CPU Core
32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
256-KB flash memory
32-KB SRAM memory
Emulated EEPROM using flash memory
Watchdog timer with dedicated internal low-speed oscillator
(ILO)
Eight-channel direct memory access (DMA) controller
Programmable GPIOs
Ultra-Low-Power
1.5-µA Deep-Sleep mode with watch crystal oscillator (WCO)
on
150-nA Hibernate mode current with SRAM retention
60-nA Stop mode current with GPIO wakeup
Programming and Debug
Temperature and Packaging
CapSense
®
Touch Sensing with Two-Finger Gestures
Up to 36 capacitive sensors for buttons, sliders, and touchpads
One-finger gestures: finger tracking, scroll, inertial scroll,
edge-swipe, click, double-click
Two-finger gestures: scroll, inertial scroll, zoom-in, zoom-out
Cypress Capacitive Sigma-Delta (CSD) provides best-in-class
SNR (> 5:1) and liquid tolerance
Automatic hardware-tuning algorithm (SmartSense™)
PSoC
®
Creator™ Design Environment
Bluetooth Low Energy Protocol Stack
Peripherals
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
Ultra-low-power LCD segment drive for 128 segments with
operation in Deep-Sleep mode
Cypress Semiconductor Corporation
Document Number: 001-95464 Rev. *J
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised September 16, 2016

CYBL11471-56LQXI Related Products

CYBL11471-56LQXI CYBL11472-56LQXI CYBL11573-76FNXI CYBL10573-76FNXI CYBL11573-76FLXI
Description Multifunction Peripheral, CMOS, QFN-56 Multifunction Peripheral, CMOS, QFN-56 Multifunction Peripheral, CMOS, PBGA76, WLCSP-76 Multifunction Peripheral, CMOS, PBGA76, WLCSP-76 Multifunction Peripheral, CMOS, PBGA76, CSP-76
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
package instruction QFN-56 HVQCCN, WLCSP-76 VFBGA, VFBGA,
Reach Compliance Code compliant compli compliant compliant compliant
boundary scan NO NO NO NO NO
Bus compatibility I2C; IDE; IRDA; LIN; SPI; UART I2C; I2S; IDE; IRDA; LIN; SPI; UART I2C; I2S; IDE; IRDA; LIN; SPI; UART I2C; I2S; IDE; IRDA; LIN; SPI; UART I2C; I2S; IDE; IRDA; LIN; SPI; UART
maximum clock frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
JESD-30 code S-XQCC-N56 S-XQCC-N56 R-PBGA-B76 R-PBGA-B76 R-PBGA-B76
length 7 mm 7 mm 4.04 mm 4.04 mm 4.04 mm
Number of I/O lines 36 36 36 36 36
Number of terminals 56 56 76 76 76
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN HVQCCN VFBGA VFBGA VFBGA
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
RAM (number of words) 16384 16384 16384 16384 16384
Maximum seat height 0.6 mm 0.6 mm 0.55 mm 0.55 mm 0.4 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD BALL BALL BALL
Terminal pitch 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm
Terminal location QUAD QUAD BOTTOM BOTTOM BOTTOM
width 7 mm 7 mm 3.87 mm 3.87 mm 3.87 mm
Base Number Matches - 1 1 1 1
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