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ST7263BHX_09

Description
Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C
File Size2MB,186 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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ST7263BHX_09 Overview

Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C

ST7263BHx ST7263BDx
ST7263BKx ST7263BEx
Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM,
DFU capability, 8-bit ADC, WDG, timer, SCI and I²C
Features
Memories
– 4, 8, 16 or 32 Kbytes Program memory:
high density Flash (HDFlash), or ROM with
Readout and Write Protection
– In-application Programming (IAP) and in-
circuit programming (ICP)
– 384, 512 or 1024 bytes RAM memory (128-
byte stack)
Clock, reset and supply management
– Run, Wait, Slow and Halt CPU modes
– 12 or 24 MHz oscillator
– RAM retention mode
– Optional low voltage detector (LVD)
Universal serial bus (USB) interface
– DMA for low speed applications compliant
with USB 1.5 Mbs (version 2.0) and HID
specifications (version 1.0)
– Integrated 3.3 V voltage regulator and
transceivers
– Supports USB DFU class specification
– Suspend and Resume operations
– 3 endpoints with programmable In/Out
configuration
Up to 27 I/O ports
– Up to 8 high sink I/Os (10 mA at 1.3 V)
– 2 very high sink true open drain I/Os
(25 mA at 1.5 V)
– Up to 8 lines individually programmable as
interrupt inputs
1 analog peripheral
– 8-bit A/D converter with 8 or 12 channels
2 timers
– Programmable watchdog
– 16-bit timer with 2 input Captures, 2 output
Compares, PWM output and clock input
SDIP32
LQFP48 (7x7)
24
1
SO34(Shrink)
SO24
QFN40 (6x6)
2 communication Interfaces
– Asynchronous serial communications inter-
face
– I²C multimaster interface up to 400 kHz
Instruction set
– 63 basic instructions
– 17 main addressing modes
– 8 x 8 unsigned multiply instruction
– True bit manipulation
Development tools
– Versatile development tools (under
Windows) including assembler, linker, C-
compiler, archiver, source level debugger,
software library, hardware emulator,
programming boards and gang
programmers, HID and DFU software
layers
Device summary
Part number
ST7263BH2, ST7263BH6
ST7263BD6
ST7263BK1, ST7263BK2,
ST7263BK4, ST7263BK6
ST7263BE1, ST7263BE2,
ST7263BE4, ST7263BE6
Table 1.
Reference
ST7263BHx
ST7263BDx
ST7263BKx
ST7263BEx
June 2009
Doc ID 7516 Rev 8
www.st.com
1/186
1

ST7263BHX_09 Related Products

ST7263BHX_09 ST7263BEx ST7263BK1B1/xxx ST7263BK1M1/xxx ST7263BK2B1/xxx ST7263BK2M1/xxx
Description Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C Low speed USB 8-bit MCU family with up to 32 KB Flash/ROM, DFU capability, 8-bit ADC, WDG, timer, SCI and I²C
Is it lead-free? - - Lead free Lead free Lead free Lead free
Is it Rohs certified? - - conform to conform to conform to conform to
Maker - - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code - - DIP SOIC DIP SOIC
package instruction - - SDIP, SDIP32,.4 SOP, SOP34,.4,40 0.400 INCH, ROHS COMPLIANT, PLASTIC, DIP-32 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-34
Contacts - - 32 34 32 34
Reach Compliance Code - - compli compli compli compli
Has ADC - - YES YES YES YES
bit size - - 8 8 8 8
CPU series - - ST72 ST72 ST72 ST72
maximum clock frequency - - 24 MHz 24 MHz 24 MHz 24 MHz
DAC channel - - NO NO NO NO
DMA channel - - YES YES YES YES
JESD-30 code - - R-PDIP-T32 R-PDSO-G34 R-PDIP-T32 R-PDSO-G34
JESD-609 code - - e3 e4 e3 e4
length - - 27.94 mm 17.894 mm 27.94 mm 17.894 mm
Number of I/O lines - - 19 19 19 19
Number of terminals - - 32 34 32 34
Maximum operating temperature - - 70 °C 70 °C 70 °C 70 °C
PWM channel - - YES YES YES YES
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - SDIP SOP SDIP SOP
Encapsulate equivalent code - - SDIP32,.4 SOP34,.4,40 SDIP32,.4 SOP34,.4,40
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - IN-LINE, SHRINK PITCH SMALL OUTLINE IN-LINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) - - NOT SPECIFIED 260 NOT SPECIFIED 260
power supply - - 5 V 5 V 5 V 5 V
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) - - 384 384 384 384
rom(word) - - 4096 4096 8192 8192
ROM programmability - - MROM MROM MROM MROM
Maximum seat height - - 5.08 mm 2.642 mm 5.08 mm 2.642 mm
speed - - 8 MHz 8 MHz 8 MHz 8 MHz
Maximum supply voltage - - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage - - 4 V 4 V 4 V 4 V
Nominal supply voltage - - 5 V 5 V 5 V 5 V
surface mount - - NO YES NO YES
technology - - CMOS CMOS CMOS CMOS
Temperature level - - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - - MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - - THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING
Terminal pitch - - 1.778 mm 1.016 mm 1.778 mm 1.016 mm
Terminal location - - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - - 15.24 mm 7.5 mm 15.24 mm 7.5 mm
uPs/uCs/peripheral integrated circuit type - - MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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