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EDJ1104BFBG-AE-F

Description
DRAM
Categorystorage    storage   
File Size2MB,147 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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EDJ1104BFBG-AE-F Overview

DRAM

EDJ1104BFBG-AE-F Parametric

Parameter NameAttribute value
MakerMicron Technology
package instruction,
Reach Compliance Codecompliant
PRELIMINARY DATA SHEET
1G bits DDR3 SDRAM
EDJ1104BFBG (256M words
×
4 bits)
EDJ1108BFBG (128M words
×
8 bits)
Specifications
Density: 1G bits
Organization
32M words
×
4 bits
×
8 banks (EDJ1104BFBG)
16M words
×
8 bits
×
8 banks (EDJ1108BFBG)
Package
78-ball FBGA
Lead-free (RoHS compliant) and Halogen-free
Power supply: VDD, VDDQ
=
1.5V
±
0.075V
Data rate
1600Mbps/1333Mbps/1066Mbps (max.)
1KB page size
Row address: A0 to A13
Column address: A0 to A9, A11 (EDJ1104BFBG)
A0 to A9 (EDJ1108BFBG)
Eight internal banks for concurrent operation
Interface: SSTL_15
Burst lengths (BL): 8 and 4 with Burst Chop (BC)
Burst type (BT):
Sequential (8, 4 with BC)
Interleave (8, 4 with BC)
/CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11
/CAS Write Latency (CWL): 5, 6, 7, 8
Precharge: auto precharge option for each burst
access
Driver strength: RZQ/7, RZQ/6 (RZQ = 240Ω)
Refresh: auto-refresh, self-refresh
Features
Double-data-rate architecture; two data transfers per
clock cycle
The high-speed data transfer is realized by the 8 bits
prefetch pipelined architecture
Bi-directional differential data strobe (DQS and /DQS)
is transmitted/received with data for capturing data at
the receiver
DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
Differential clock inputs (CK and /CK)
DLL aligns DQ and DQS transitions with CK
transitions
Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
Data mask (DM) for write data
Posted /CAS by programmable additive latency for
better command and data bus efficiency
On-Die Termination (ODT) for better signal quality
Synchronous ODT
Dynamic ODT
Asynchronous ODT
Multi Purpose Register (MPR) for pre-defined pattern
read out
ZQ calibration for DQ drive and ODT
Programmable Partial Array Self-Refresh (PASR)
/RESET pin for Power-up sequence and reset
function
SRT range:
Normal/extended
Programmable Output driver impedance control
Refresh cycles
Average refresh period
7.8µs at 0°C
TC
≤ +85°C
3.9µs at
+85°C <
TC
≤ +95°C
Operating case temperature range
TC = 0°C to +95°C
Document No. E1629E20 (Ver. 2.0)
Date Published July 2010 (K) Japan
Printed in Japan
URL: http://www.elpida.com
©Elpida
Memory, Inc. 2010

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