MEMORY MODULE,DRAM,FAST PAGE,512KX40,CMOS,SSIM,72PIN,PLASTIC
| Parameter Name | Attribute value |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | SIMM |
| package instruction | , |
| Contacts | 72 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 70 ns |
| Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 code | R-XSMA-N72 |
| memory density | 20971520 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 40 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 72 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX40 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | SINGLE |
| MC-42512AA40F-70 | MC-42512AA40B-80 | MC-42512AB40B-70 | MC-42512AA40B-10 | |
|---|---|---|---|---|
| Description | MEMORY MODULE,DRAM,FAST PAGE,512KX40,CMOS,SSIM,72PIN,PLASTIC | 512KX40 FAST PAGE DRAM MODULE, 80ns, SMA72, SIMM-72 | MEMORY MODULE,DRAM,FAST PAGE,512KX40,CMOS,SSIM,72PIN,PLASTIC | 512K X 40 FAST PAGE DRAM MODULE, 100 ns, SMA72, SIMM-72 |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | SIMM | SIMM | SIMM | SIMM |
| Contacts | 72 | 72 | 72 | 72 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| Maximum access time | 70 ns | 80 ns | 70 ns | 100 ns |
| Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| JESD-30 code | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
| memory density | 20971520 bit | 20971520 bit | 20971520 bit | 20971520 bit |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 40 | 40 | 40 | 40 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 72 | 72 | 72 | 72 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX40 | 512KX40 | 512KX40 | 512KX40 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 | 1024 | 512 |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
京公网安备 11010802033920号
EEWORLD
