KM41C4000AZ-10 datasheet, PDF - EEWORLD Datasheet

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KM41C4000AZ-10: DescriptionFast Page DRAM, 4MX1, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20; Categorystorage storage; File Size513KB，17 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM41C4000AZ-10 Overview

Fast Page DRAM, 4MX1, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20

KM41C4000AZ-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	ZIP
package instruction	ZIP, ZIP20,.1
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE
JESD-30 code	R-PZIP-T20
JESD-609 code	e0
length	26.165 mm
memory density	4194304 bit
Memory IC Type	FAST PAGE DRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	20
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	ZIP
Encapsulate equivalent code	ZIP20,.1
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	10.16 mm
self refresh	NO
Maximum standby current	0.001 A
Maximum slew rate	0.085 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.96 mm

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KM41C4000AZ-10 Related Products

	KM41C4000AZ-10	KM41C4000AZ-7	KM41C4000AJ-8	KM41C4000AJ-10	KM41C4000AZ-8	KM41C4000AP-10	KM41C4000AJ-7	KM41C4000AP-7	KM41C4000AP-8
Description	Fast Page DRAM, 4MX1, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20	Fast Page DRAM, 4MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20	Fast Page DRAM, 4MX1, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 4MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18	Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, PLASTIC, SOJ-26/20	Fast Page DRAM, 4MX1, 70ns, CMOS, PDIP18, PLASTIC, DIP-18	Fast Page DRAM, 4MX1, 80ns, CMOS, PDIP18, PLASTIC, DIP-18
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	ZIP	ZIP	SOJ	SOJ	ZIP	DIP	SOJ	DIP	DIP
package instruction	ZIP, ZIP20,.1	ZIP, ZIP20,.1	SOJ, SOJ20/26,.34	SOJ, SOJ20/26,.34	ZIP, ZIP20,.1	DIP, DIP18,.3	SOJ, SOJ20/26,.34	DIP, DIP18,.3	DIP, DIP18,.3
Contacts	20	20	20	20	20	18	20	18	18
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	100 ns	70 ns	80 ns	100 ns	80 ns	100 ns	70 ns	70 ns	80 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PZIP-T20	R-PZIP-T20	R-PDSO-J20	R-PDSO-J20	R-PZIP-T20	R-PDIP-T18	R-PDSO-J20	R-PDIP-T18	R-PDIP-T18
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	26.165 mm	26.165 mm	17.145 mm	17.145 mm	26.165 mm	22.02 mm	17.145 mm	22.02 mm	22.02 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	18	20	18	18
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1	4MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	ZIP	ZIP	SOJ	SOJ	ZIP	DIP	SOJ	DIP	DIP
Encapsulate equivalent code	ZIP20,.1	ZIP20,.1	SOJ20/26,.34	SOJ20/26,.34	ZIP20,.1	DIP18,.3	SOJ20/26,.34	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024	1024	1024	1024
Maximum seat height	10.16 mm	10.16 mm	3.68 mm	3.68 mm	10.16 mm	4.65 mm	3.68 mm	4.65 mm	4.65 mm
self refresh	NO	NO	NO	NO	NO	NO	NO	NO	NO
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.085 mA	0.105 mA	0.095 mA	0.085 mA	0.095 mA	0.085 mA	0.105 mA	0.105 mA	0.095 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	DUAL	DUAL	ZIG-ZAG	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	2.96 mm	2.96 mm	7.62 mm	7.62 mm	2.96 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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