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HY5PS121621BFP-22

Description
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, LEAD FREE, FBGA-84
Categorystorage    storage   
File Size3MB,77 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Environmental Compliance
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HY5PS121621BFP-22 Overview

DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, LEAD FREE, FBGA-84

HY5PS121621BFP-22 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA, BGA84,9X15,32
Contacts84
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.45 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)450 MHz
I/O typeCOMMON
interleaved burst length4,8
JESD-30 codeR-PBGA-B84
JESD-609 codee1
length13 mm
memory density536870912 bit
Memory IC TypeDDR DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals84
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature
organize32MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA84,9X15,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply2.1 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.2 mm
self refreshYES
Continuous burst length4,8
Maximum standby current0.012 A
Maximum supply voltage (Vsup)2.2 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)2.1 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width10.5 mm
HY5PS121621BFP
512Mb(32Mx16) DDR2 SDRAM
HY5PS121621BFP
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.5 / Jun. 2006
1

HY5PS121621BFP-22 Related Products

HY5PS121621BFP-22 HY5PS121621BFP-28 HY5PS121621BFP-25 HY5PS121621BFP-25L HY5PS121621BFP-33 HY5PS121621BFP-2
Description DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, LEAD FREE, FBGA-84 DDR DRAM, 32MX16, 0.55ns, CMOS, PBGA84, LEAD FREE, FBGA-84 DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, LEAD FREE, FBGA-84 DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, LEAD FREE, FBGA-84 DDR DRAM, 32MX16, 0.6ns, CMOS, PBGA84, LEAD FREE, FBGA-84 DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, LEAD FREE, FBGA-84
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction TFBGA, BGA84,9X15,32 TFBGA, BGA84,9X15,32 TFBGA, BGA84,9X15,32 TFBGA, BGA84,9X15,32 TFBGA, BGA84,9X15,32 TFBGA, BGA84,9X15,32
Contacts 84 84 84 84 84 84
Reach Compliance Code unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.45 ns 0.55 ns 0.5 ns 0.5 ns 0.6 ns 0.45 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 450 MHz 350 MHz 400 MHz 400 MHz 300 MHz 500 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
interleaved burst length 4,8 4,8 4,8 4,8 4,8 4,8
JESD-30 code R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84
JESD-609 code e1 e1 e1 e1 e1 e1
length 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm
memory density 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bi
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 84 84 84 84 84 84
word count 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words
character code 32000000 32000000 32000000 32000000 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
organize 32MX16 32MX16 32MX16 32MX16 32MX16 32MX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA84,9X15,32 BGA84,9X15,32 BGA84,9X15,32 BGA84,9X15,32 BGA84,9X15,32 BGA84,9X15,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 2.1 V 1.8 V 2 V 1.8 V 1.8 V 2.1 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192 8192 8192 8192
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES YES YES YES
Continuous burst length 4,8 4,8 4,8 4,8 4,8 4,8
Maximum standby current 0.012 A 0.009 A 0.01 A 0.01 A 0.008 A 0.014 A
Maximum supply voltage (Vsup) 2.2 V 1.9 V 2.1 V 1.9 V 1.9 V 2.2 V
Minimum supply voltage (Vsup) 2 V 1.7 V 1.9 V 1.75 V 1.7 V 2 V
Nominal supply voltage (Vsup) 2.1 V 1.8 V 2 V 1.8 V 1.8 V 2.1 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 20 20 20 20 20
width 10.5 mm 10.5 mm 10.5 mm 10.5 mm 10.5 mm 10.5 mm
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