EEPROM, 512X8, 85ns, Parallel, CMOS, CDIP20, CERAMIC, DIP-20
| Parameter Name | Attribute value |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 20 |
| Reach Compliance Code | unknow |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 85 ns |
| JESD-30 code | R-CDIP-T20 |
| length | 24.2 mm |
| memory density | 4096 bi |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 29623DM/883B | 29623DM | 29611DC | 29623DC | 29661DC | 29653DMB | |
|---|---|---|---|---|---|---|
| Description | EEPROM, 512X8, 85ns, Parallel, CMOS, CDIP20, CERAMIC, DIP-20 | EEPROM, 512X8, 85ns, Parallel, CMOS, CDIP20, CERAMIC, DIP-20 | EEPROM, 512X4, 55ns, Parallel, CMOS, CDIP16, CERAMIC, DIP-16 | EEPROM, 512X8, 70ns, Parallel, CMOS, CDIP20, CERAMIC, DIP-20 | EEPROM, 256X4, 55ns, Parallel, CMOS, CDIP16, CERAMIC, DIP-16 | EEPROM, 2KX4, 90ns, Parallel, CMOS, CDIP18, CERAMIC, DIP-18 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 20 | 20 | 16 | 20 | 16 | 18 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknow |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C |
| Maximum access time | 85 ns | 85 ns | 55 ns | 70 ns | 55 ns | 90 ns |
| JESD-30 code | R-CDIP-T20 | R-CDIP-T20 | R-CDIP-T16 | R-CDIP-T20 | R-CDIP-T16 | R-CDIP-T18 |
| memory density | 4096 bi | 4096 bi | 2048 bi | 4096 bi | 1024 bit | 8192 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 4 | 8 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 16 | 20 | 16 | 18 |
| word count | 512 words | 512 words | 512 words | 512 words | 256 words | 2048 words |
| character code | 512 | 512 | 512 | 512 | 256 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 75 °C | 75 °C | 70 °C | 125 °C |
| organize | 512X8 | 512X8 | 512X4 | 512X8 | 256X4 | 2KX4 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| length | 24.2 mm | 24.2 mm | - | 24.2 mm | - | 23.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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