5962-01-220-2228 datasheet, PDF

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5962-01-220-2228: DescriptionIC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC; Categorylogic logic; File Size219KB，5 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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5962-01-220-2228 Overview

IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC

5962-01-220-2228 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microchip
package instruction	DIP, DIP20,.3
Reach Compliance Code	compli
JESD-30 code	R-XDIP-T20
Logic integrated circuit type	D FLIP-FLOP
MaximumI(ol)	0.012 A
Number of functions	8
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	POSITIVE EDGE

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5962-01-220-2228 Related Products

	5962-01-220-2228	74HCT534D	74HCT574D	74HCT564D
Description	IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC	IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC	IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC	IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Microchip	Microchip	Microchip	Microchip
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	compli	compli	compli	compliant
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
MaximumI(ol)	0.012 A	0.012 A	0.012 A	0.012 A
Number of functions	8	8	8	8
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
JESD-609 code	-	e0	e0	e0
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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