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74HCT574D

Description
IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC
Categorylogic    logic   
File Size219KB,5 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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74HCT574D Overview

IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC

74HCT574D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrochip
package instructionDIP, DIP20,.3
Reach Compliance Codecompli
JESD-30 codeR-XDIP-T20
JESD-609 codee0
Logic integrated circuit typeD FLIP-FLOP
MaximumI(ol)0.012 A
Number of functions8
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger typePOSITIVE EDGE

74HCT574D Related Products

74HCT574D 74HCT534D 74HCT564D 5962-01-220-2228
Description IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Microchip Microchip Microchip Microchip
package instruction DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code compli compli compliant compli
JESD-30 code R-XDIP-T20 R-XDIP-T20 R-XDIP-T20 R-XDIP-T20
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
MaximumI(ol) 0.012 A 0.012 A 0.012 A 0.012 A
Number of functions 8 8 8 8
Number of terminals 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -55 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
JESD-609 code e0 e0 e0 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
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