IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | compli |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| MaximumI(ol) | 0.012 A |
| Number of functions | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| 74HCT534D | 74HCT574D | 74HCT564D | 5962-01-220-2228 | |
|---|---|---|---|---|
| Description | IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HCT-CMOS,DIP,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Microchip | Microchip | Microchip | Microchip |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | compli | compli | compliant | compli |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| MaximumI(ol) | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| Number of functions | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| JESD-609 code | e0 | e0 | e0 | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
京公网安备 11010802033920号
EEWORLD
