Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Glass-Sealed, 14 Pin, HERMETIC SEALED, CERDIP-14
| Parameter Name | Attribute value |
| Maker | Semicoa |
| package instruction | IN-LINE, R-GDIP-T14 |
| Reach Compliance Code | unknow |
| Maximum collector current (IC) | 0.8 A |
| Collector-emitter maximum voltage | 50 V |
| Configuration | SEPARATE, 4 ELEMENTS |
| Minimum DC current gain (hFE) | 30 |
| JESD-30 code | R-GDIP-T14 |
| Number of components | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 200 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Polarity/channel type | NPN |
| Guideline | MIL-19500; RH - 100K Rad(Si) |
| surface mount | NO |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |

| JANTXVR2N6989 | 2N6989JS | 2N6989J | 2N6989JX | 2N6989JV | 2N6989 | |
|---|---|---|---|---|---|---|
| Description | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Glass-Sealed, 14 Pin, HERMETIC SEALED, CERDIP-14 | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Metal-Sealed Cofired, 14 Pin, HERMETIC SEALED, CERAMIC, DIP-14 | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Metal-Sealed Cofired, 14 Pin, HERMETIC SEALED, CERAMIC, DIP-14 | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Metal-Sealed Cofired, 14 Pin, HERMETIC SEALED, CERAMIC, DIP-14 | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Metal-Sealed Cofired, 14 Pin, HERMETIC SEALED, CERAMIC, DIP-14 | Power Bipolar Transistor, 0.8A I(C), 50V V(BR)CEO, 4-Element, NPN, Silicon, Ceramic, Metal-Sealed Cofired, 14 Pin, HERMETIC SEALED, CERAMIC, DIP-14 |
| package instruction | IN-LINE, R-GDIP-T14 | HERMETIC SEALED, CERAMIC, DIP-14 | HERMETIC SEALED, CERAMIC, DIP-14 | HERMETIC SEALED, CERAMIC, DIP-14 | HERMETIC SEALED, CERAMIC, DIP-14 | IN-LINE, R-CDIP-T14 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | compliant |
| Maximum collector current (IC) | 0.8 A | 0.8 A | 0.8 A | 0.8 A | 0.8 A | 0.8 A |
| Collector-emitter maximum voltage | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
| Minimum DC current gain (hFE) | 30 | 30 | 30 | 30 | 30 | 30 |
| JESD-30 code | R-GDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 |
| Number of components | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Polarity/channel type | NPN | NPN | NPN | NPN | NPN | NPN |
| surface mount | NO | NO | NO | NO | NO | NO |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Guideline | MIL-19500; RH - 100K Rad(Si) | MIL-19500 | MIL-19500 | MIL-19500 | MIL-19500 | - |
| Parts packaging code | - | DIP | DIP | DIP | DIP | DIP |
| Contacts | - | 14 | 14 | 14 | 14 | 14 |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |