Philips Semiconductors
Objective specification
Power stage 2
×
80 W class-D
audio amplifier
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.2.1
8.2.2
8.3
9
10
11
12
13
14
14.1
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAMS
PINNING INFORMATION
FUNCTIONAL DESCRIPTION
Power stage
Protections
Overtemperature
Short-circuit across the loudspeaker terminals
BTL operation
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
DC CHARACTERISTICS
AC CHARACTERISTICS
SWITCHING CHARACTERISTICS
Duty factor
15
15.1
15.2
15.3
15.4
15.5
15.6
16
17
17.1
17.2
17.2.1
17.2.2
17.3
17.3.1
17.3.2
17.3.3
17.4
18
19
20
TDA8927
TEST AND APPLICATION INFORMATION
BTL application
Remarks
Output power
Reference designs
Reference design bill of material
Curves measured in reference design
PACKAGE OUTLINES
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2001 Dec 11
2
Philips Semiconductors
Objective specification
Power stage 2
×
80 W class-D
audio amplifier
1
FEATURES
•
Multimedia systems
•
All mains fed audio systems
•
Car audio (boosters).
3
GENERAL DESCRIPTION
TDA8927
•
High efficiency (>94%)
•
Operating voltage from
±15
to
±30
V
•
Very low quiescent current
•
High output power
•
Short-circuit proof across the load, only in combination
with controller TDA8929T
•
Diagnostic output
•
Usable as a stereo Single-Ended (SE) amplifier or as a
mono amplifier in Bridge-Tied Load (BTL)
•
Electrostatic discharge protection (pin to pin)
•
Thermally protected, only in combination with controller
TDA8929T.
2
APPLICATIONS
The TDA8927 is the switching power stage of a two-chip
set for a high efficiency class-D audio power amplifier
system. The system is split into two chips:
•
TDA8927J/ST/TH; a digital power stage in a DBS17P,
RDBS17P or HSOP24 power package
•
TDA8929T; the analog controller chip in a SO24
package.
With this chip set a compact 2
×
80 W audio amplifier
system can be built, operating with high efficiency and very
low dissipation. No heatsink is required, or depending on
supply voltage and load, a very small one. The system
operates over a wide supply voltage range from
±15
up to
±30
V and consumes a very low quiescent
current.
•
Television sets
•
Home-sound sets
4
QUICK REFERENCE DATA
SYMBOL
General;
V
P
=
±25
V
V
P
I
q(tot)
η
P
o
supply voltage
total quiescent current
efficiency
PARAMETER
CONDITIONS
MIN.
±15
TYP.
±25
35
94
MAX.
±30
45
−
−
−
−
−
UNIT
V
mA
%
no load connected
P
o
= 30 W
R
L
= 4
Ω;
THD = 10%; V
P
=
±25
V
R
L
= 4
Ω;
THD = 10%; V
P
=
±27
V
−
−
60
74
Stereo single-ended configuration
output power
65
80
W
W
Mono bridge-tied load configuration
P
o
output power
R
L
= 4
Ω;
THD = 10%; V
P
=
±17
V
R
L
= 8
Ω;
THD = 10%; V
P
=
±25
V
5
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA8927J
TDA8927ST
TDA8927TH
DBS17P
RDBS17P
HSOP24
DESCRIPTION
plastic DIL-bent-SIL power package; 17 leads (lead length
12 mm)
plastic rectangular-DIL-bent-SIL power package; 17 leads (row
spacing 2.54 mm)
plastic, heatsink small outline package; 24 leads; low stand-off
height
VERSION
SOT243-1
SOT577-1
SOT566-2
90
120
110
150
W
W
2001 Dec 11
3
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