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TDA7551

Description
DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size86KB,12 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

TDA7551 Overview

DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS

TDA7551 Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
Parts packaging codeQFP
package instructionLQFP,
Contacts80
Reach Compliance Codecompli
ECCN code3A001.A.3
Address bus width22
barrel shifterNO
boundary scanNO
maximum clock frequency50 MHz
External data bus width8
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PQFP-G80
length14 mm
low power modeNO
Number of terminals80
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
®
TDA7550/R TDA7551
TDA7552 TDA7553
DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND
AUDIO APPLICATIONS
PRODUCT PREVIEW
24-BIT, FIXED POINT, 50 MIPS DSP CORE
LARGE ON-BOARD PROGRAM ROM AND
DATA RAM (UP TO 16Kw ROM/RAM AND
16Kw RAM)
INTEGRATED STEREO A/D AND D/A, 16-BIT
SIGMA-DELTA
PROGRAMMABLE CODEC SAMPLE RATE
FROM 4 TO 48 kHz
ON-BOARD PLL FOR CORE CLOCK AND
CONVERTERS
MANAGEMENT
OF
EXTERNAL
FLASH/SRAM/DRAM MEMORY BANK
I
2
C OR SPI SERIAL INTERFACE FOR EX-
TERNAL CONTROL
80-PIN TQFP, 0.65 mm PITCH
AUTOMOTIVE GRADE (FROM -40° C to
+85°C)
DESCRIPTION
The TDA755X family is a high performances, fully
programmable 24-bit, 50 MIPS Digital Signal
BLOCK DIAGRAM
MULTIPLEXED BUS
TQFP80
Processor (DSP), designed to support several
speech and audio applications, as Automatic
Speech Recognition, Speech Synthesis, Speaker
Verification, Echo and Noise Cancellation. Soft-
ware for these applications is licenced by Lernout
& Hauspie and NCTI.
It offers an effective solution for this kind of appli-
cations because of the A/D and D/A converters
and the big amount of memory integrated on chip.
I
2
C/SPI
PORT
FLASH
INTERFACE
SAI
ROM/RAM
RAM
8
FLAGS
DSP
CORE
DAC
L
ANALOG OUT
R
L
ANALOG IN
R
ADC
PLL
D99AU1020A
September 1999
This is preliminary information on a new product now in development. Details are subject to change without notice.
1/12

TDA7551 Related Products

TDA7551 TDA7552 TDA7550R TDA7550
Description DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS DIGITAL SIGNAL PROCESSING IC FOR SPEECH AND AUDIO APPLICATIONS
Parts packaging code QFP QFP QFP QFP
package instruction LQFP, LQFP, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80 LQFP,
Contacts 80 80 80 80
Reach Compliance Code compli compli compli unknow
ECCN code 3A001.A.3 3A001.A.3 3A991.A.2 3A001.A.3
Address bus width 22 22 22 22
barrel shifter NO NO NO NO
boundary scan NO NO NO NO
maximum clock frequency 50 MHz 50 MHz 40 MHz 50 MHz
External data bus width 8 8 8 8
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80
length 14 mm 14 mm 14 mm 14 mm
low power mode NO NO NO NO
Number of terminals 80 80 80 80
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3.15 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
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